JP7075185B2 - Coil parts and electronic equipment - Google Patents

Coil parts and electronic equipment Download PDF

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JP7075185B2
JP7075185B2 JP2017088776A JP2017088776A JP7075185B2 JP 7075185 B2 JP7075185 B2 JP 7075185B2 JP 2017088776 A JP2017088776 A JP 2017088776A JP 2017088776 A JP2017088776 A JP 2017088776A JP 7075185 B2 JP7075185 B2 JP 7075185B2
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core
dummy terminal
coil component
dummy
terminal
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JP2018186242A (en
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千春 林
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Taiyo Yuden Co Ltd
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Taiyo Yuden Co Ltd
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Priority to US15/960,391 priority patent/US10153083B2/en
Priority to CN201810393170.9A priority patent/CN108806927B/en
Priority to US16/183,511 priority patent/US10755849B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/04—Fixed inductances of the signal type with magnetic core
    • H01F17/043—Fixed inductances of the signal type with magnetic core with two, usually identical or nearly identical parts enclosing completely the coil (pot cores)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/06—Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H01F27/26—Fastening parts of the core together; Fastening or mounting the core on casing or support
    • H01F27/263—Fastening parts of the core together
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2823—Wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2823—Wires
    • H01F27/2828—Construction of conductive connections, of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/04—Fixed inductances of the signal type with magnetic core
    • H01F17/045—Fixed inductances of the signal type with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
    • H01F2017/046—Fixed inductances of the signal type with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core helical coil made of flat wire, e.g. with smaller extension of wire cross section in the direction of the longitudinal axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/06—Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
    • H01F2027/065—Mounting on printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/08—Cooling; Ventilating
    • H01F27/22—Cooling by heat conduction through solid or powdered fillings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Coils Of Transformers For General Uses (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)

Description

本発明は、コイル部品及び電子機器に関する。 The present invention relates to coil parts and electronic devices.

コイル部品の用途が広がり、振動や衝撃に対する高い耐久性が求められている。例えば、コイル導体を内部に含むコアにダミー端子を取り付けることで、回路基板に実装する際の実装強度が向上することが知られている（例えば、特許文献１）。 The applications of coil parts are expanding, and high durability against vibration and shock is required. For example, it is known that by attaching a dummy terminal to a core including a coil conductor inside, the mounting strength at the time of mounting on a circuit board is improved (for example, Patent Document 1).

特開２００４－２２１４７４号公報Japanese Unexamined Patent Publication No. 2004-221474

しかしながら、特許文献１に記載のコイル部品では、大きな振動や衝撃が加わることで、コイル導体に変形や変位が生じたり、場合によってはコイル導体に断線が生じたりすることがある。 However, in the coil component described in Patent Document 1, a large vibration or impact may cause deformation or displacement of the coil conductor, or in some cases, disconnection of the coil conductor.

本発明は、上記課題に鑑みなされたものであり、振動や衝撃に対する耐久性を向上させることを目的とする。 The present invention has been made in view of the above problems, and an object of the present invention is to improve durability against vibration and impact.

本発明は、下側コアと上側コアとが接合され、内部に柱状部と前記柱状部の周辺の空洞とを有するコアと、前記柱状部の周囲に配置された螺旋状部と、前記螺旋状部から前記コアの下面となる前記下側コアの主外表面に向かって引き出され、前記コアの下面に平行で外部端子となる端部を含む引出部と、を有するコイル導体と、前記コアに装着され、前記コアの下面に少なくとも設けられ、前記コイル導体と電気的に絶縁されたダミー端子と、を備え、前記ダミー端子は、前記コアの下面に位置する下部と、前記螺旋状部を挟んで前記下面に対向する前記上側コアの主外表面である前記コアの上面に位置する上部と、前記下部と前記上部を連結する側部と、を有し、前記ダミー端子は、前記ダミー端子の先端が前記外部端子よりも前記コアの下面の中心近くに位置するように、前記コアの下面の端から前記コアの下面の内側に延在し、前記ダミー端子の前記コアの下面に位置する前記下部の総底面積は、前記外部端子の総底面積より大きい、コイル部品である。 In the present invention, the lower core and the upper core are joined to each other, a core having a columnar portion and a cavity around the columnar portion, a spiral portion arranged around the columnar portion, and the spiral portion. A coil conductor having a coil conductor drawn from the portion toward the main outer surface of the lower core, which is the lower surface of the core, and including an end portion parallel to the lower surface of the core and serving as an external terminal, and the core. It comprises a dummy terminal mounted, at least provided on the lower surface of the core and electrically isolated from the coil conductor, the dummy terminal sandwiching the lower portion located on the lower surface of the core and the spiral portion. It has an upper portion located on the upper surface of the core, which is the main outer surface of the upper core facing the lower surface, and a side portion connecting the lower portion and the upper portion, and the dummy terminal is a dummy terminal of the dummy terminal. The tip extends from the edge of the lower surface of the core to the inside of the lower surface of the core so that the tip is located closer to the center of the lower surface of the core than the external terminal, and is located on the lower surface of the core of the dummy terminal. The total bottom area of the lower part is a coil component larger than the total bottom area of the external terminal.

上記構成において、前記コイル導体の前記引出部のうちの前記螺旋状部と前記端部との間を接続する接続部は接着剤によって少なくとも前記コアに接着している構成とすることができる。 In the above configuration, the connecting portion connecting the spiral portion and the end portion of the drawer portion of the coil conductor may be configured to be adhered to at least the core by an adhesive.

上記構成において、前記コイル導体の前記外部端子は接着剤によって前記コアの下面に接着している構成とすることができる。 In the above configuration, the external terminal of the coil conductor may be bonded to the lower surface of the core with an adhesive.

上記構成において、複数の前記ダミー端子を備え、前記コイル導体の前記外部端子は前記コアの下面のうちの第１辺側に配置され、前記複数のダミー端子それぞれの前記下部は前記コアの下面のうちの互いに対向する第２辺及び第３辺それぞれの側に配置されている構成とすることができる。 In the above configuration, the plurality of dummy terminals are provided, the external terminal of the coil conductor is arranged on the first side of the lower surface of the core, and the lower portion of each of the plurality of dummy terminals is the lower surface of the core. It can be configured to be arranged on each side of the second side and the third side facing each other.

上記構成において、前記ダミー端子は、前記上部から前記側部に延在した開口を有し、前記開口に接着剤が充填されている構成とすることができる。 In the above configuration, the dummy terminal may have an opening extending from the upper portion to the side portion, and the opening may be filled with an adhesive.

上記構成において、前記ダミー端子は、前記下部と、前記上部と、前記下部と前記上部を連結する３つの前記側部と、を有し、前記コアを収納する開口を有する箱型形状をしている構成とすることができる。 In the above configuration, the dummy terminal has a box shape having the lower part, the upper part, and three side portions connecting the lower part and the upper part, and having an opening for accommodating the core. Can be configured as

上記構成において、前記ダミー端子は前記上部が前記下部よりも面積の大きな形状をしている構成とすることができる。 In the above configuration, the dummy terminal may have a shape in which the upper portion has a larger area than the lower portion.

上記構成において、前記ダミー端子の前記上部は前記コアの上面全面を覆っている構成とすることができる。 In the above configuration, the upper portion of the dummy terminal may cover the entire upper surface of the core.

本発明は、上記のいずれかに記載のコイル部品と、前記コイル部品が実装された回路基板と、を備える電子機器である。 The present invention is an electronic device including the coil component according to any one of the above and a circuit board on which the coil component is mounted.

上記構成において、前記コイル導体は２つの前記引出部を有し、前記２つの引出部のうちの一方の引出部は前記コアの上面側で前記螺旋状部から引き出され、他方の引出部は前記コアの下面側で前記螺旋状部から引き出され、前記一方の引出部の前記外部端子が接続された前記回路基板の第１パッドは、前記他方の引出部の前記外部端子が接続された前記回路基板の第２パッドよりも高い電圧が印加される構成とすることができる。 In the above configuration, the coil conductor has two drawers, one of the two drawers is drawn from the spiral on the upper surface side of the core, and the other drawer is the leader. The first pad of the circuit board, which is drawn from the spiral portion on the lower surface side of the core and to which the external terminal of the one drawer portion is connected, is the circuit to which the external terminal of the other drawer portion is connected. The configuration may be such that a voltage higher than that of the second pad of the substrate is applied.

本発明によれば、振動や衝撃に対する耐久性を向上させることができる。 According to the present invention, the durability against vibration and impact can be improved.

図１（ａ）は実施例１に係るコイル部品の斜視図、図１（ｂ）は下面側から見た平面図、図１（ｃ）は図１（ａ）のＡ－Ａ間の断面斜視図である。1 (a) is a perspective view of the coil component according to the first embodiment, FIG. 1 (b) is a plan view seen from the lower surface side, and FIG. 1 (c) is a cross-sectional perspective view between A and A in FIG. 1 (a). It is a figure. 図２（ａ）及び図２（ｂ）は上側コアの斜視図、図２（ｃ）及び図２（ｄ）は下側コアの斜視図である。2 (a) and 2 (b) are perspective views of the upper core, and FIGS. 2 (c) and 2 (d) are perspective views of the lower core. 図３（ａ）から図３（ｃ）はコイル導体の斜視図である。3 (a) to 3 (c) are perspective views of the coil conductor. 図４はダミー端子の斜視図である。FIG. 4 is a perspective view of the dummy terminal. 図５は実施例２に係るコイル部品の斜視図である。FIG. 5 is a perspective view of the coil component according to the second embodiment. 図６は実施例３に係るコイル部品の斜視図である。FIG. 6 is a perspective view of the coil component according to the third embodiment. 図７（ａ）は実施例４に係るコイル部品の斜視図、図７（ｂ）は図７（ａ）のＡ－Ａ間の断面斜視図、図７（ｃ）はダミー端子の斜視図である。7 (a) is a perspective view of the coil component according to the fourth embodiment, FIG. 7 (b) is a sectional perspective view between A and A of FIG. 7 (a), and FIG. 7 (c) is a perspective view of a dummy terminal. be. 図８（ａ）は実施例５に係るコイル部品の斜視図、図８（ｂ）は下面側から見た平面図である。FIG. 8A is a perspective view of the coil component according to the fifth embodiment, and FIG. 8B is a plan view seen from the lower surface side. 図９（ａ）は実施例６に係るコイル部品の斜視図、図９（ｂ）は図９（ａ）のＡ－Ａ間の断面斜視図である。9 (a) is a perspective view of the coil component according to the sixth embodiment, and FIG. 9 (b) is a sectional perspective view between A and A of FIG. 9 (a). 図１０（ａ）は実施例７に係るコイル部品の斜視図、図１０（ｂ）は下面側から見た平面図、図１０（ｃ）はダミー端子の斜視図である。10 (a) is a perspective view of the coil component according to the seventh embodiment, FIG. 10 (b) is a plan view seen from the lower surface side, and FIG. 10 (c) is a perspective view of a dummy terminal. 図１１（ａ）は実施例８に係るコイル部品の断面斜視図、図１１（ｂ）はダミー端子の斜視図である。11 (a) is a cross-sectional perspective view of the coil component according to the eighth embodiment, and FIG. 11 (b) is a perspective view of a dummy terminal. 図１２（ａ）は実施例９に係る電子機器の平面図、図１２（ｂ）は図１２（ａ）のＡ－Ａ間の断面図、図１２（ｃ）は図１２（ａ）のＢ－Ｂ間の断面図である。12 (a) is a plan view of the electronic device according to the ninth embodiment, FIG. 12 (b) is a sectional view between A and A of FIG. 12 (a), and FIG. 12 (c) is B of FIG. 12 (a). It is sectional drawing between -B.

以下、図面を参照して、本発明の実施例について説明する。 Hereinafter, examples of the present invention will be described with reference to the drawings.

図１（ａ）は、実施例１に係るコイル部品１００の斜視図、図１（ｂ）は、下面側から見た平面図、図１（ｃ）は、図１（ａ）のＡ－Ａ間の断面斜視図である。なお、以下の説明では、コイル部品１００を回路基板に実装したときに、コイル部品１００に対して回路基板が鉛直下方に位置することを前提にして上下方向を規定することとする。また、コイル導体４０の端部４６ａ、４６ｂ及びダミー端子６０の下部７２には半田が形成されるが、図３（ｃ）、図４、図１２（ｂ）、及び図１２（ｃ）以外の図においては半田の図示を省略する。図１（ａ）から図１（ｃ）のように、実施例１のコイル部品１００は、コア１０と、コイル導体４０と、ダミー端子６０と、を備えるインダクタ素子である。 1A is a perspective view of the coil component 100 according to the first embodiment, FIG. 1B is a plan view seen from the lower surface side, and FIG. 1C is AA of FIG. 1A. It is a cross-sectional perspective view of the space. In the following description, when the coil component 100 is mounted on the circuit board, the vertical direction is defined on the assumption that the circuit board is located vertically below the coil component 100. Further, although solder is formed on the ends 46a and 46b of the coil conductor 40 and the lower portion 72 of the dummy terminal 60, other than FIGS. 3 (c), 4 (4), 12 (b) and 12 (c). In the figure, the illustration of solder is omitted. As shown in FIGS. 1A to 1C, the coil component 100 of the first embodiment is an inductor element including a core 10, a coil conductor 40, and a dummy terminal 60.

コア１０は、上側コア１２と下側コア１４とが例えば熱硬化性樹脂等の接着剤によって接合されて形成されている。コア１０は、上部１６と下部１８と側部２０とを有するとともに内部に空洞２２を有する。コア１０は、平面視において１辺が例えば１３ｍｍ～１７ｍｍ程度の大きさで角部が丸みを帯びた矩形形状をしていて、例えば６ｍｍ～８．５ｍｍ程度の高さを有している。コア１０は、１つの側面側において空洞２２が外部に露出するように開口している。コア１０は、空洞２２内に柱状部２４を有する。柱状部２４は、上部１６と下部１８との間を上下方向に延在している。なお、コア１０の外表面に例えば厚さが５μｍ～５０μｍ程度のガラス膜が設けられていてもよい。これにより、絶縁性及び防錆性が向上する。 The core 10 is formed by joining the upper core 12 and the lower core 14 with an adhesive such as a thermosetting resin. The core 10 has an upper portion 16, a lower portion 18, and a side portion 20, and has a cavity 22 inside. The core 10 has a rectangular shape with one side having a size of, for example, about 13 mm to 17 mm and rounded corners in a plan view, and has a height of, for example, about 6 mm to 8.5 mm. The core 10 is open so that the cavity 22 is exposed to the outside on one side surface side. The core 10 has a columnar portion 24 in the cavity 22. The columnar portion 24 extends vertically between the upper portion 16 and the lower portion 18. A glass film having a thickness of, for example, about 5 μm to 50 μm may be provided on the outer surface of the core 10. This improves the insulating property and the rust preventive property.

図２（ａ）及び図２（ｂ）は、上側コア１２の斜視図、図２（ｃ）及び図２（ｄ）は、下側コア１４の斜視図である。図２（ａ）及び図２（ｃ）は、上方側から見た場合の斜視図であり、図２（ｂ）及び図２（ｄ）は、下方側から見た場合の斜視図である。図２（ａ）及び図２（ｂ）のように、上側コア１２は、上部１６となる蓋部１７と側部２０ａとを有し、内側に空洞２２ａが形成されている。空洞２２ａ内には、円柱状の柱状部２４ａが形成されている。蓋部１７と側部２０ａ及び柱状部２４ａとの角部は丸みを帯びた形状に面取りされている。これにより振動や衝撃に対する耐久性を向上させることができる。側部２０ａと柱状部２４ａの高さは略同じになっていて、例えば３ｍｍ～５ｍｍ程度である。柱状部２４ａの直径は例えば５ｍｍ～８ｍｍ程度である。上側コア１２は、磁性体で形成され、例えばフェライト材料や金属磁性体材料で形成されている。 2 (a) and 2 (b) are perspective views of the upper core 12, and FIGS. 2 (c) and 2 (d) are perspective views of the lower core 14. 2 (a) and 2 (c) are perspective views when viewed from above, and FIGS. 2 (b) and 2 (d) are perspective views when viewed from below. As shown in FIGS. 2A and 2B, the upper core 12 has a lid portion 17 and a side portion 20a which are upper portions 16, and a cavity 22a is formed inside. A columnar columnar portion 24a is formed in the cavity 22a. The corners of the lid portion 17, the side portions 20a, and the columnar portions 24a are chamfered into a rounded shape. This makes it possible to improve the durability against vibration and impact. The heights of the side portion 20a and the columnar portion 24a are substantially the same, for example, about 3 mm to 5 mm. The diameter of the columnar portion 24a is, for example, about 5 mm to 8 mm. The upper core 12 is made of a magnetic material, for example, a ferrite material or a metal magnetic material.

図２（ｃ）及び図２（ｄ）のように、下側コア１４は、下部１８となる底部１９と側部２０ｂとを有し、内側に空洞２２ｂが形成されている。空洞２２ｂ内には、円柱状の柱状部２４ｂが形成されている。底部１９と側部２０ｂ及び柱状部２４ｂとの角部は丸みを帯びた形状に面取りされている。側部２０ｂと柱状部２４ｂの高さは略同じで且つ上側コア１２の側部２０ａと柱状部２４ａの高さよりも低くなっていて、例えば２ｍｍ～２．５ｍｍ程度である。柱状部２４ｂの直径は上側コア１２の柱状部２４ａと略同じであり、例えば５ｍｍ～８ｍｍ程度である。下側コア１４は、磁性体で形成され、例えば上側コア１２と同じ材料のフェライト材料や金属磁性体材料で形成されている。 As shown in FIGS. 2 (c) and 2 (d), the lower core 14 has a bottom portion 19 and a side portion 20b which are lower portions 18, and a cavity 22b is formed inside. A columnar columnar portion 24b is formed in the cavity 22b. The corners of the bottom 19, the side 20b, and the column 24b are chamfered into a rounded shape. The heights of the side portions 20b and the columnar portions 24b are substantially the same and lower than the heights of the side portions 20a and the columnar portions 24a of the upper core 12, for example, about 2 mm to 2.5 mm. The diameter of the columnar portion 24b is substantially the same as that of the columnar portion 24a of the upper core 12, and is, for example, about 5 mm to 8 mm. The lower core 14 is made of a magnetic material, for example, a ferrite material or a metal magnetic material of the same material as the upper core 12.

図１（ａ）から図１（ｃ）及び図２（ａ）から図２（ｄ）のように、上側コア１２の側部２０ａと下側コア１４の側部２０ｂとが接合してコア１０の側部２０が形成され、上側コア１２の柱状部２４ａと下側コア１４の柱状部２４ｂとが接合してコア１０の柱状部２４が形成されている。なお、下側コア１４は平坦形状をした底部１９のみで形成され、側部２０ｂ及び柱状部２４ｂは形成されてなく、上側コア１２の側部２０ａ及び柱状部２４ａが下側コア１４の平坦形状をした底部１９に接合することでコア１０が形成されていてもよい。 As shown in FIGS. 1 (a) to 1 (c) and 2 (a) to 2 (d), the side portion 20a of the upper core 12 and the side portion 20b of the lower core 14 are joined to form the core 10. 20 is formed, and the columnar portion 24a of the upper core 12 and the columnar portion 24b of the lower core 14 are joined to form the columnar portion 24 of the core 10. The lower core 14 is formed only by the flat bottom portion 19, the side portion 20b and the columnar portion 24b are not formed, and the side portion 20a and the columnar portion 24a of the upper core 12 have the flat shape of the lower core 14. The core 10 may be formed by joining to the bottom portion 19 which has been formed.

次に、コイル導体４０について、図１（ａ）から図１（ｃ）に加えて、図３（ａ）から図３（ｃ）を用いて説明する。図３（ａ）から図３（ｃ）は、コイル導体４０の斜視図である。図３（ａ）は、コイル導体４０を上方側から見た斜視図、図３（ｂ）は、下方側から見た斜視図、図３（ｃ）は、端部４６ａ、４６ｂに半田８０が形成された状態の斜視図である。コイル導体４０は、コア１０の空洞２２内であって柱状部２４の周囲に配置された螺旋状部４２と、螺旋状部４２からコア１０の下面２８に向かって引き出され、コア１０の下面２８に平行な１対の端部４６ａ、４６ｂを含む引出部４８ａ、４８ｂと、を有する。また、引出部４８ａは螺旋状部４２と端部４６ａとの間を接続する接続部４４ａを含み、引出部４８ｂは螺旋状部４２と端部４６ｂとの間を接続する接続部４４ｂを含む。引出部４８ａはコア１０の上部１６側で螺旋状部４２から引き出され、引出部４８ｂはコア１０の下部１８側で螺旋状部４２から引き出されている。 Next, the coil conductor 40 will be described with reference to FIGS. 1 (a) to 1 (c) and FIGS. 3 (a) to 3 (c). 3 (a) to 3 (c) are perspective views of the coil conductor 40. 3 (a) is a perspective view of the coil conductor 40 viewed from above, FIG. 3 (b) is a perspective view viewed from below, and FIG. 3 (c) shows solder 80 at the ends 46a and 46b. It is a perspective view of the formed state. The coil conductor 40 is drawn from the spiral portion 42 arranged around the columnar portion 24 in the cavity 22 of the core 10 and toward the lower surface 28 of the core 10 from the spiral portion 42, and the lower surface 28 of the core 10 is formed. It has a drawer 48a, 48b, including a pair of ends 46a, 46b parallel to. Further, the drawer portion 48a includes a connection portion 44a connecting between the spiral portion 42 and the end portion 46a, and the drawer portion 48b includes a connection portion 44b connecting between the spiral portion 42 and the end portion 46b. The pull-out portion 48a is pulled out from the spiral portion 42 on the upper 16 side of the core 10, and the pull-out portion 48b is pulled out from the spiral portion 42 on the lower 18 side of the core 10.

螺旋状部４２とコア１０との間に接着剤８２が設けられていて、螺旋状部４２とコア１０とは接着剤８２によって接着している。接着剤８２は、例えば熱硬化性樹脂である。接着剤８２に熱硬化性樹脂を用いることで、耐熱性及び接着強度を向上させることができる。コイル導体４０の幅Ｗは例えば２．０ｍｍ～３．２ｍｍ程度である。コイル導体４０は絶縁被膜（例えばポリアミドイミド）付きの導線（例えば銅（Ｃｕ）線）からなる。コイル導体４０は、例えば平角線コイルであるが、丸線コイルであってもよい。端部４６ａ、４６ｂの底面に、コイル部品１００を回路基板に実装する際に用いられる半田８０が設けられる。半田８０は、例えばＳｎ－３Ａｇ－０．７５Ｃｕの組成の半田である。このように、端部４６ａ、４６ｂは、コイル部品１００を回路基板に実装する際に用いられる半田８０が形成される外部端子４９ａ、４９ｂとなる。半田８０は、端部４６ａ、４６ｂの底面に加えて接続部４４ａ、４４ｂのうちの端部４６ａ、４６ｂ側の一部分に設けられていてもよい。これにより、より強固にコイル部品１００を回路基板に実装できる。 An adhesive 82 is provided between the spiral portion 42 and the core 10, and the spiral portion 42 and the core 10 are adhered to each other by the adhesive 82. The adhesive 82 is, for example, a thermosetting resin. By using a thermosetting resin for the adhesive 82, heat resistance and adhesive strength can be improved. The width W of the coil conductor 40 is, for example, about 2.0 mm to 3.2 mm. The coil conductor 40 is made of a conducting wire (for example, copper (Cu) wire) with an insulating coating (for example, polyamide-imide). The coil conductor 40 is, for example, a flat wire coil, but may be a round wire coil. Solder 80 used for mounting the coil component 100 on the circuit board is provided on the bottom surfaces of the ends 46a and 46b. The solder 80 is, for example, a solder having a composition of Sn-3Ag-0.75Cu. In this way, the end portions 46a and 46b are external terminals 49a and 49b on which the solder 80 used when mounting the coil component 100 on the circuit board is formed. The solder 80 may be provided on a part of the connecting portions 44a and 44b on the end portions 46a and 46b side in addition to the bottom surface of the end portions 46a and 46b. As a result, the coil component 100 can be mounted on the circuit board more firmly.

次に、ダミー端子６０について、図１（ａ）から図１（ｃ）に加えて、図４を用いて説明する。図４は、ダミー端子６０の斜視図である。ダミー端子６０は、コイル導体４０と電気的に絶縁されていて、コイル部品１００の電気特性にほとんど寄与しない端子である。ダミー端子６０は、コア１０の上面２６から側面３０を経由して下面２８に延在してコア１０に装着している。なお、コア１０の下面２８はコア１０の主外表面であり、上面２６は下面２８に対向する面であり、側面３０は上面２６と下面２８に接続する面である。このように、ダミー端子６０は、コア１０の上面２６に位置する上部７０と、下面２８に位置する下部７２と、側面３０に位置して上部７０と下部７２とを連結する側部７４と、を有する形状（略Ｕ字型形状）をしている。 Next, the dummy terminal 60 will be described with reference to FIGS. 1 (a) to 1 (c) and FIG. FIG. 4 is a perspective view of the dummy terminal 60. The dummy terminal 60 is a terminal that is electrically insulated from the coil conductor 40 and hardly contributes to the electrical characteristics of the coil component 100. The dummy terminal 60 extends from the upper surface 26 of the core 10 to the lower surface 28 via the side surface 30 and is attached to the core 10. The lower surface 28 of the core 10 is the main outer surface of the core 10, the upper surface 26 is a surface facing the lower surface 28, and the side surface 30 is a surface connecting the upper surface 26 and the lower surface 28. As described above, the dummy terminal 60 includes an upper portion 70 located on the upper surface 26 of the core 10, a lower portion 72 located on the lower surface 28, and a side portion 74 located on the side surface 30 and connecting the upper portion 70 and the lower portion 72. It has a shape (substantially U-shaped).

ダミー端子６０は、コイル導体４０の引出部４８ａ、４８ｂが引き出された側とは反対側のコア１０の側面３０に位置してコア１０に装着している。ダミー端子６０の側部７４とコア１０との間には接着剤８２が設けられていて、側部７４とコア１０とは接着剤８２によって接着している。なお、上部７０とコア１０とが接着剤８２で接着していてもよい。ダミー端子６０は、例えばニッケル（Ｎｉ）－錫（Ｓｎ）めっきが施された銅（Ｃｕ）又は銅（Ｃｕ）合金で形成されているが、その他の金属で形成されていてもよい。ダミー端子６０の下部７２の底面に、コイル部品１００を回路基板に実装する際に用いられる半田８０が設けられる。半田８０は、ダミー端子６０の下部７２の底面に加えてダミー端子６０の側部７４のうちの下部７２側の一部分に設けられていてもよい。これにより、より強固にコイル部品１００を回路基板に実装できる。 The dummy terminal 60 is located on the side surface 30 of the core 10 on the side opposite to the side from which the drawing portions 48a and 48b of the coil conductor 40 are pulled out, and is mounted on the core 10. An adhesive 82 is provided between the side portion 74 of the dummy terminal 60 and the core 10, and the side portion 74 and the core 10 are adhered to each other by the adhesive 82. The upper portion 70 and the core 10 may be adhered with the adhesive 82. The dummy terminal 60 is formed of, for example, a nickel (Ni) -tin (Sn) plated copper (Cu) or copper (Cu) alloy, but may be formed of any other metal. A solder 80 used for mounting the coil component 100 on the circuit board is provided on the bottom surface of the lower portion 72 of the dummy terminal 60. The solder 80 may be provided on a part of the side portion 74 of the dummy terminal 60 on the lower 72 side in addition to the bottom surface of the lower portion 72 of the dummy terminal 60. As a result, the coil component 100 can be mounted on the circuit board more firmly.

ダミー端子６０の幅Ｗは例えば５ｍｍ～９ｍｍ程度であり、コイル導体４０の幅Ｗよりも広くなっている。ダミー端子６０の下部７２の底面積Ｓ１（図１（ｂ）のクロスハッチ部分）は、外部端子４９ａ、４９ｂの底面積（例えば端部４６ａ、４６ｂの底面積）Ｓ２ａ、Ｓ２ｂ（図１（ｂ）のクロスハッチ部分）の合計よりも大きくなっている（Ｓ１＞Ｓ２ａ＋Ｓ２ｂ）。 The width W of the dummy terminal 60 is, for example, about 5 mm to 9 mm, which is wider than the width W of the coil conductor 40. The bottom area S1 (crosshatch portion in FIG. 1B) of the lower portion 72 of the dummy terminal 60 is the bottom area of the external terminals 49a and 49b (for example, the bottom area of the ends 46a and 46b) S2a and S2b (FIG. 1 (b). ) Is larger than the total (S1> S2a + S2b).

このように、実施例１によれば、ダミー端子６０の下部７２の総底面積Ｓ１は、外部端子４９ａ、４９ｂの総底面積（Ｓ２ａ＋Ｓ２ｂ）よりも大きくなっている（Ｓ１＞Ｓ２ａ＋Ｓ２ｂ）。ダミー端子６０の下部７２の総底面積Ｓ１が小さいと、コイル部品１００を回路基板に実装するときの衝撃や実装後の振動によって外部端子４９ａ、４９ｂに大きな機械的応力がかかり、コイル導体４０が損傷する場合がある。しかしながら、ダミー端子６０の下部７２の総底面積Ｓ１を大きくすることで、振動や衝撃による機械的応力がダミー端子６０により多く分散されるようになり、外部端子４９ａ、４９ｂにかかる機械的応力を低減することができる。よって、コイル部品１００に加わる振動や衝撃に対する耐久性を向上させることができる。 As described above, according to the first embodiment, the total bottom area S1 of the lower portion 72 of the dummy terminal 60 is larger than the total bottom area (S2a + S2b) of the external terminals 49a and 49b (S1> S2a + S2b). When the total bottom area S1 of the lower portion 72 of the dummy terminal 60 is small, a large mechanical stress is applied to the external terminals 49a and 49b due to the impact when the coil component 100 is mounted on the circuit board and the vibration after mounting, and the coil conductor 40 is subjected to. May be damaged. However, by increasing the total bottom area S1 of the lower portion 72 of the dummy terminal 60, the mechanical stress due to vibration or impact becomes more dispersed in the dummy terminal 60, and the mechanical stress applied to the external terminals 49a and 49b is reduced. Can be reduced. Therefore, it is possible to improve the durability against vibration and impact applied to the coil component 100.

また、コイル部品１００は動作に伴って発熱するが、ダミー端子６０の下部７２の総底面積Ｓ１を大きくすることで、コイル部品１００が実装される回路基板への放熱性を向上させることができる。 Further, although the coil component 100 generates heat as it operates, by increasing the total bottom area S1 of the lower portion 72 of the dummy terminal 60, it is possible to improve the heat dissipation to the circuit board on which the coil component 100 is mounted. ..

また、実施例１によれば、図１（ｂ）のように、コイル導体４０の外部端子４９ａ、４９ｂはコア１０の下面２８のうちの辺３２側に配置され、ダミー端子６０の下部７２はコア１０の下面２８のうちの辺３２に対向する辺３４側に配置されている。これにより、振動や衝撃による機械的応力を外部端子４９ａ、４９ｂとダミー端子６０とに効果的に分散させることができるため、耐久性がさらに向上する。 Further, according to the first embodiment, as shown in FIG. 1B, the external terminals 49a and 49b of the coil conductor 40 are arranged on the side 32 side of the lower surface 28 of the core 10, and the lower portion 72 of the dummy terminal 60 is. It is arranged on the side 34 facing the side 32 of the lower surface 28 of the core 10. As a result, the mechanical stress due to vibration or impact can be effectively dispersed between the external terminals 49a and 49b and the dummy terminal 60, so that the durability is further improved.

外部端子４９ａ、４９ｂにかかる機械的応力を低減する点から、ダミー端子６０の下部７２の総底面積は、外部端子４９ａ、４９ｂの総底面積の１．５倍以上の場合が好ましく、２倍以上の場合がより好ましく、３倍以上の場合がさらに好ましい。 From the viewpoint of reducing the mechanical stress applied to the external terminals 49a and 49b, the total bottom area of the lower portion 72 of the dummy terminal 60 is preferably 1.5 times or more the total bottom area of the external terminals 49a and 49b. The above case is more preferable, and the case of 3 times or more is further preferable.

図１（ｃ）のように、ダミー端子６０の下部７２は接着剤によってコア１０に接着されない形態としてもよい。コア１０の下面２８は回路基板に実装される実装面であることから、ダミー端子６０の下部７２が接着剤でコア１０に接着されないことで、この接着剤によるコイル導体４０の外部端子４９ａ、４９ｂの底面の汚れを抑制でき、その結果、実装不良が発生することを抑制できる。 As shown in FIG. 1 (c), the lower portion 72 of the dummy terminal 60 may be formed so as not to be adhered to the core 10 by an adhesive. Since the lower surface 28 of the core 10 is a mounting surface mounted on the circuit board, the lower portion 72 of the dummy terminal 60 is not adhered to the core 10 with an adhesive, so that the external terminals 49a and 49b of the coil conductor 40 using this adhesive are used. It is possible to suppress the dirt on the bottom surface of the surface, and as a result, it is possible to suppress the occurrence of mounting defects.

コイル導体４０の端部４６ａ、４６ｂに形成される半田８０の厚さは、ダミー端子６０の下部７２に形成される半田８０の厚さよりも厚い場合が好ましい。これにより、コイル部品１００を回路基板に実装する際に、コイル導体４０の外部端子４９ａ、４９ｂが回路基板のパッドに接続されないことを抑制できる。なお、一例として、コイル導体４０の端部４６ａ、４６ｂに形成される半田８０の厚さは３μｍ～３０μｍの場合が好ましい。半田濡れ性のためである。また、コイル導体４０端部４６ａ、４６ｂに形成される半田８０の厚さとダミー端子６０の下部７２に形成される半田８０の厚さとの差は２０μｍ以下の場合が好ましい。実装時の半田濡れ性のバランスのためである。 The thickness of the solder 80 formed on the ends 46a and 46b of the coil conductor 40 is preferably thicker than the thickness of the solder 80 formed on the lower portion 72 of the dummy terminal 60. This makes it possible to prevent the external terminals 49a and 49b of the coil conductor 40 from being connected to the pads of the circuit board when the coil component 100 is mounted on the circuit board. As an example, the thickness of the solder 80 formed on the ends 46a and 46b of the coil conductor 40 is preferably 3 μm to 30 μm. This is because of the solder wettability. Further, the difference between the thickness of the solder 80 formed on the ends 46a and 46b of the coil conductor 40 and the thickness of the solder 80 formed on the lower portion 72 of the dummy terminal 60 is preferably 20 μm or less. This is because of the balance of solder wettability at the time of mounting.

図５は、実施例２に係るコイル部品２００の斜視図である。図５のように、実施例２のコイル部品２００では、コイル導体４０の引出部４８ａ、４８ｂのうちの接続部４４ａ、４４ｂが接着剤８４によって少なくともコア１０に接着している。例えば、接続部４４ａは接着剤８４によってコア１０及び螺旋状部４２に接着し、接続部４４ｂは接着剤８４によってコア１０に接着している。接着剤８４は、例えば熱硬化性樹脂や光硬化性樹脂等、様々な接着部材を用いることができるが、熱硬化性樹脂を用いることで耐熱性及び接着強度を向上させることができる。その他の構成は実施例１と同じであるため説明を省略する。 FIG. 5 is a perspective view of the coil component 200 according to the second embodiment. As shown in FIG. 5, in the coil component 200 of the second embodiment, the connecting portions 44a and 44b of the drawer portions 48a and 48b of the coil conductor 40 are adhered to at least the core 10 by the adhesive 84. For example, the connecting portion 44a is adhered to the core 10 and the spiral portion 42 by the adhesive 84, and the connecting portion 44b is adhered to the core 10 by the adhesive 84. As the adhesive 84, various adhesive members such as a thermosetting resin and a photocurable resin can be used, and the heat resistance and the adhesive strength can be improved by using the thermosetting resin. Since other configurations are the same as those in the first embodiment, the description thereof will be omitted.

実施例２によれば、コイル導体４０の接続部４４ａ、４４ｂは接着剤８４によって少なくともコア１０に接着している。これにより、接続部４４ａ、４４ｂに外部から機械的応力が加わった場合でも接続部４４ａ、４４ｂの変形が抑制される。よって、振動や衝撃に対する耐久性を向上させることができる。 According to the second embodiment, the connecting portions 44a and 44b of the coil conductor 40 are adhered to at least the core 10 by the adhesive 84. As a result, even when mechanical stress is applied to the connecting portions 44a and 44b from the outside, the deformation of the connecting portions 44a and 44b is suppressed. Therefore, the durability against vibration and impact can be improved.

接続部４４ａ、４４ｂの変形を抑制する点から、コア１０の上部１６側で螺旋状部４２から引き出された引出部４８ａに含まれる接続部４４ａは接着剤８４によってコア１０と螺旋状部４２とに接着している場合が好ましい。 From the viewpoint of suppressing deformation of the connecting portions 44a and 44b, the connecting portion 44a included in the drawing portion 48a drawn from the spiral portion 42 on the upper 16 side of the core 10 is connected to the core 10 and the spiral portion 42 by the adhesive 84. It is preferable that it is adhered to.

図６は、実施例３に係るコイル部品３００の斜視図である。図６のように、実施例３のコイル部品３００では、コイル導体４０の端部４６ａ、４６ｂが接着剤８４によってコア１０の下面２８に接着している。すなわち、コイル導体４０の外部端子４９ａ、４９ｂが接着剤８４によってコア１０の下面２８に接着している。その他の構成は実施例１と同じであるため説明を省略する。 FIG. 6 is a perspective view of the coil component 300 according to the third embodiment. As shown in FIG. 6, in the coil component 300 of the third embodiment, the ends 46a and 46b of the coil conductor 40 are adhered to the lower surface 28 of the core 10 by the adhesive 84. That is, the external terminals 49a and 49b of the coil conductor 40 are adhered to the lower surface 28 of the core 10 by the adhesive 84. Since other configurations are the same as those in the first embodiment, the description thereof will be omitted.

実施例３によれば、コイル導体４０の外部端子４９ａ、４９ｂが接着剤８４によってコア１０の下面２８に接着している。これにより、外部端子４９ａ、４９ｂに外部から機械的応力が加わった場合でも外部端子４９ａ、４９ｂの変形が抑制される。よって、振動や衝撃に対する耐久性を向上させることができる。なお、接着剤８４による実装不良が発生することを抑制するために、接着剤８４はコイル導体４０の外部端子４９ａ、４９ｂとコア１０の下面２８との間から外部に漏れ出ないようにすることが好ましい。 According to the third embodiment, the external terminals 49a and 49b of the coil conductor 40 are adhered to the lower surface 28 of the core 10 by the adhesive 84. As a result, even when mechanical stress is applied to the external terminals 49a and 49b from the outside, the deformation of the external terminals 49a and 49b is suppressed. Therefore, the durability against vibration and impact can be improved. In addition, in order to suppress the occurrence of mounting defects due to the adhesive 84, the adhesive 84 should be prevented from leaking to the outside from between the external terminals 49a and 49b of the coil conductor 40 and the lower surface 28 of the core 10. Is preferable.

図７（ａ）は、実施例４に係るコイル部品４００の斜視図、図７（ｂ）は、図７（ａ）のＡ－Ａ間の断面斜視図、図７（ｃ）は、ダミー端子６２の斜視図である。図７（ａ）から図７（ｃ）のように、実施例４のコイル部品４００では、ダミー端子６２は上部７０から側部７４に延在した開口７６を有する。すなわち、開口７６はダミー端子６２の上部７０と側部７４との角部を含む位置に形成されている。開口７６には接着剤８６が充填されている。したがって、接着剤８６は、ダミー端子６２とコア１０との間を接着するとともに、開口７６におけるダミー端子６２の側面に接着している。接着剤８６は、熱硬化性樹脂でもよいし、光硬化性樹脂でもよいし、その他の接着部材でもよい。その他の構成は実施例１と同じであるため説明を省略する。 7 (a) is a perspective view of the coil component 400 according to the fourth embodiment, FIG. 7 (b) is a sectional perspective view between A and A of FIG. 7 (a), and FIG. 7 (c) is a dummy terminal. 62 is a perspective view of 62. As shown in FIGS. 7 (a) to 7 (c), in the coil component 400 of the fourth embodiment, the dummy terminal 62 has an opening 76 extending from the upper portion 70 to the side portion 74. That is, the opening 76 is formed at a position including the corner portion between the upper portion 70 and the side portion 74 of the dummy terminal 62. The opening 76 is filled with the adhesive 86. Therefore, the adhesive 86 adheres between the dummy terminal 62 and the core 10 and also adheres to the side surface of the dummy terminal 62 in the opening 76. The adhesive 86 may be a thermosetting resin, a photocurable resin, or other adhesive member. Since other configurations are the same as those in the first embodiment, the description thereof will be omitted.

実施例４によれば、ダミー端子６２は上部７０から側部７４に延在した開口７６を有する。開口７６には接着剤８６が充填されている。このように、ダミー端子６２に設けた開口７６に接着剤８６を充填させることで、開口７６の側面部分が接着に寄与するようになるため、ダミー端子６２とコア１０との接着面積が大きくなる。これにより、ダミー端子６２をコア１０に強固に接着させることができる。ダミー端子６２がコア１０に強固に接着することは、振動や衝撃による機械的応力を外部端子４９ａ、４９ｂとダミー端子６２とに分散させる効果が得られることに繋がる。よって、コイル部品４００に加わる振動や衝撃に対する耐久性を向上させることができる。 According to the fourth embodiment, the dummy terminal 62 has an opening 76 extending from the upper portion 70 to the side portion 74. The opening 76 is filled with the adhesive 86. By filling the opening 76 provided in the dummy terminal 62 with the adhesive 86 in this way, the side surface portion of the opening 76 contributes to the adhesion, so that the adhesion area between the dummy terminal 62 and the core 10 becomes large. .. As a result, the dummy terminal 62 can be firmly adhered to the core 10. The strong adhesion of the dummy terminal 62 to the core 10 leads to the effect of distributing the mechanical stress due to vibration or impact to the external terminals 49a and 49b and the dummy terminal 62. Therefore, it is possible to improve the durability against vibration and impact applied to the coil component 400.

また、ダミー端子６２に設けた開口７６に接着剤８６を充填させることで、ダミー端子６２が接着剤８６によってコア１０に接着されていることを外部から確認することができる。これにより、ダミー端子６２に接着剤が付いていない等の不良を外観にて検査することが簡単にできる。 Further, by filling the opening 76 provided in the dummy terminal 62 with the adhesive 86, it can be confirmed from the outside that the dummy terminal 62 is adhered to the core 10 by the adhesive 86. This makes it easy to visually inspect defects such as no adhesive attached to the dummy terminal 62.

また、実施例４によれば、開口７６はダミー端子６２の上部７０から側部７４に延在して設けられている。これにより、ダミー端子６２をコア１０に嵌合させるときに、ダミー端子６２に発生する応力を緩和させることができる。また、ダミー端子６２の上部７０を側部７４に対して曲げ加工をする際の加工性を向上させることができる。 Further, according to the fourth embodiment, the opening 76 extends from the upper portion 70 of the dummy terminal 62 to the side portion 74. As a result, the stress generated in the dummy terminal 62 when the dummy terminal 62 is fitted to the core 10 can be relaxed. Further, it is possible to improve the workability when bending the upper portion 70 of the dummy terminal 62 with respect to the side portion 74.

図８（ａ）は、実施例５に係るコイル部品５００の斜視図、図８（ｂ）は、下面側から見た平面図である。図８（ａ）及び図８（ｂ）のように、実施例５のコイル部品５００では、複数のダミー端子６０ａ、６０ｂがコア１０に装着している。ダミー端子６０ａ、６０ｂは、コイル導体４０の引出部４８ａ、４８ｂが引き出されたコア１０の側面に交差する側面に互いに対向して設けられている。このため、コイル導体４０の外部端子４９ａ、４９ｂはコア１０の下面２８のうちの辺３２側に配置され、ダミー端子６０ａ、６０ｂそれぞれの下部７２ａ、７２ｂはコア１０の下面２８のうちの辺３２に交差し且つ互いに対向する辺３６、３８それぞれの側に配置されている。ダミー端子６０ａ、６０ｂの下部７２ａ、７２ｂの底面積Ｓ１ａ、Ｓ１ｂ（クロスハッチ部分）の合計（Ｓ１ａ＋Ｓ１ｂ）は、外部端子４９ａ、４９ｂの底面積Ｓ２ａ、Ｓ２ｂ（クロスハッチ部分）の合計よりも大きくなっている（Ｓ１ａ＋Ｓ１ｂ＞Ｓ２ａ＋Ｓ２ｂ）。その他の構成は実施例１と同じであるため説明を省略する。 8 (a) is a perspective view of the coil component 500 according to the fifth embodiment, and FIG. 8 (b) is a plan view seen from the lower surface side. As shown in FIGS. 8A and 8B, in the coil component 500 of the fifth embodiment, a plurality of dummy terminals 60a and 60b are mounted on the core 10. The dummy terminals 60a and 60b are provided so as to face each other on the side surfaces where the extraction portions 48a and 48b of the coil conductor 40 intersect the side surfaces of the extracted core 10. Therefore, the external terminals 49a and 49b of the coil conductor 40 are arranged on the side 32 of the lower surface 28 of the core 10, and the lower portions 72a and 72b of the dummy terminals 60a and 60b, respectively, are the sides 32 of the lower surface 28 of the core 10. It is arranged on each side of the sides 36 and 38 that intersect with each other and face each other. The total (S1a + S1b) of the bottom areas S1a and S1b (crosshatch portion) of the lower portions 72a and 72b of the dummy terminals 60a and 60b is larger than the total of the bottom areas S2a and S2b (crosshatch portion) of the external terminals 49a and 49b. (S1a + S1b> S2a + S2b). Since other configurations are the same as those in the first embodiment, the description thereof will be omitted.

実施例５によれば、複数のダミー端子６０ａ、６０ｂが設けられている。この場合でも、複数のダミー端子６０ａ、６０ｂの下部７２ａ、７２ｂの総底面積（Ｓ１ａ＋Ｓ１ｂ）を外部端子４９ａ、４９ｂの総底面積（Ｓ２ａ＋Ｓ２ｂ）よりも大きくすることで、実施例１と同じく、コイル部品５００に加わる振動や衝撃に対する耐久性を向上させることができる。 According to the fifth embodiment, a plurality of dummy terminals 60a and 60b are provided. Even in this case, the coil is formed in the same manner as in the first embodiment by making the total bottom area (S1a + S1b) of the lower portions 72a and 72b of the plurality of dummy terminals 60a and 60b larger than the total bottom area (S2a + S2b) of the external terminals 49a and 49b. It is possible to improve the durability against vibration and impact applied to the component 500.

また、実施例５によれば、コイル導体４０の外部端子４９ａ、４９ｂはコア１０の下面２８のうちの辺３２側に配置され、複数のダミー端子６０ａ、６０ｂの下部７２ａ、７２ｂはコア１０の下面２８のうちの互いに対向する辺３６、３８それぞれの側に配置されている。これにより、コイル部品５００に加わる振動や衝撃による機械的応力を外部端子４９ａ、４９ｂとダミー端子６０ａ、６０ｂとに効果的に分散させることができるため、耐久性がさらに向上する。なお、機械的応力の分散の点から、ダミー端子６０ａ、６０ｂの下部７２ａ、７２ｂは辺３６、３８の間の中心線に対して線対称に設けられていることが好ましい。 Further, according to the fifth embodiment, the external terminals 49a and 49b of the coil conductor 40 are arranged on the side 32 side of the lower surface 28 of the core 10, and the lower portions 72a and 72b of the plurality of dummy terminals 60a and 60b are the core 10. It is arranged on each of the sides 36 and 38 of the lower surface 28 facing each other. As a result, the mechanical stress due to vibration or impact applied to the coil component 500 can be effectively dispersed between the external terminals 49a and 49b and the dummy terminals 60a and 60b, so that the durability is further improved. From the viewpoint of dispersion of mechanical stress, it is preferable that the lower portions 72a and 72b of the dummy terminals 60a and 60b are provided line-symmetrically with respect to the center line between the sides 36 and 38.

図９（ａ）は、実施例６に係るコイル部品６００の斜視図、図９（ｂ）は、図９（ａ）のＡ－Ａ間の断面斜視図である。図９（ａ）及び図９（ｂ）のように、実施例６のコイル部品６００では、ダミー端子６０は上部７０が下部７２よりも大きな形状をしている。すなわち、ダミー端子６０は上部７０の面積が下部７２の面積よりも大きくなっている。その他の構成は実施例１と同じであるため説明を省略する。 9 (a) is a perspective view of the coil component 600 according to the sixth embodiment, and FIG. 9 (b) is a sectional perspective view between A and A in FIG. 9 (a). As shown in FIGS. 9A and 9B, in the coil component 600 of the sixth embodiment, the upper portion 70 of the dummy terminal 60 has a shape larger than that of the lower portion 72. That is, the area of the upper 70 of the dummy terminal 60 is larger than the area of the lower 72. Since other configurations are the same as those in the first embodiment, the description thereof will be omitted.

実施例１ではダミー端子６０は下部７２が上部７０よりも面積の大きな形状をしていたが、実施例６のようにダミー端子６０は上部７０が下部７２よりも面積の大きな形状をしている場合でもよい。ダミー端子６０の上部７０が下部７２よりも面積が大きい場合、ダミー端子６０をグランドに接続することによってコイル導体４０から発生する電界を効果的にシールドすることができる。 In the first embodiment, the lower portion 72 of the dummy terminal 60 has a larger area than the upper portion 70, but as in the sixth embodiment, the upper portion 70 of the dummy terminal 60 has a larger area than the lower portion 72. It may be the case. When the upper 70 of the dummy terminal 60 has a larger area than the lower 72, the electric field generated from the coil conductor 40 can be effectively shielded by connecting the dummy terminal 60 to the ground.

なお、電界をシールドする点から、ダミー端子６０の上部７０は、コア１０の上面２６の１／２以上を覆っている場合が好ましく、２／３以上を覆っている場合がより好ましく、全面を覆っている場合がさらに好ましい。 From the viewpoint of shielding the electric field, the upper portion 70 of the dummy terminal 60 preferably covers 1/2 or more of the upper surface 26 of the core 10, more preferably 2/3 or more, and covers the entire surface. It is more preferable to cover it.

図１０（ａ）は、実施例７に係るコイル部品７００の斜視図、図１０（ｂ）は、下面側から見た平面図、図１０（ｃ）は、ダミー端子６４の斜視図である。図１０（ａ）から図１０（ｃ）のように、実施例７のコイル部品７００では、ダミー端子６４は、上部７０と、下部７２と、上部７０及び下部７２に連結した３つの側部７４と、を有する箱型形状をしている。コア１０は箱型形状をしたダミー端子６４内に収納されている。このため、コア１０の上面２６の全面がダミー端子６４の上部７０で覆われている。また、コア１０の側面３０も全面がダミー端子６４の側部７４で覆われている。その他の構成は実施例１と同じであるため説明を省略する。 10 (a) is a perspective view of the coil component 700 according to the seventh embodiment, FIG. 10 (b) is a plan view seen from the lower surface side, and FIG. 10 (c) is a perspective view of the dummy terminal 64. As shown in FIGS. 10A to 10C, in the coil component 700 of the seventh embodiment, the dummy terminal 64 has three side portions 74 connected to the upper portion 70, the lower portion 72, and the upper portion 70 and the lower portion 72. It has a box shape with and. The core 10 is housed in a box-shaped dummy terminal 64. Therefore, the entire surface of the upper surface 26 of the core 10 is covered with the upper portion 70 of the dummy terminal 64. Further, the entire surface of the side surface 30 of the core 10 is also covered with the side portion 74 of the dummy terminal 64. Since other configurations are the same as those in the first embodiment, the description thereof will be omitted.

実施例７によれば、ダミー端子６４は、コア１０の上面２６に位置する上部７０と下面２８に位置する下部７２と側面３０に位置して上部７０と下部７２を連結する３つの側部７４とを有し、コア１０を収納する開口を有する箱型形状をしている。このように、コア１０が箱型形状をしたダミー端子６４に収納されていることで、コイル部品７００に加わる振動や衝撃に対する耐久性をより向上させることができる。また、コア１０の上面２６及び側面３０がダミー端子６４で覆われることで、コイル導体４０で発生した熱の放熱性をより向上させることができる。 According to the seventh embodiment, the dummy terminal 64 has three side portions 74 located on the upper surface 26 of the core 10, the lower portion 72 located on the lower surface 28, and the lower portion 72 located on the side surface 30 and connecting the upper portion 70 and the lower portion 72. It has a box shape and has an opening for accommodating the core 10. As described above, since the core 10 is housed in the box-shaped dummy terminal 64, the durability against vibration and impact applied to the coil component 700 can be further improved. Further, by covering the upper surface 26 and the side surface 30 of the core 10 with the dummy terminal 64, the heat dissipation of the heat generated in the coil conductor 40 can be further improved.

また、実施例７によれば、ダミー端子６４の上部７０はコア１０の上面２６の全面を覆っている。これにより、コイル導体４０から発生する電界をより効果的にシールドすることができる。 Further, according to the seventh embodiment, the upper portion 70 of the dummy terminal 64 covers the entire upper surface 26 of the core 10. As a result, the electric field generated from the coil conductor 40 can be shielded more effectively.

図１１（ａ）は、実施例８に係るコイル部品８００の断面斜視図、図１１（ｂ）は、ダミー端子６６の斜視図である。図１１（ａ）及び図１１（ｂ）のように、実施例８のコイル部品８００では、ダミー端子６６は、コア１０の下面２８に位置する下部７２と側面３０に位置して下部７２に連結した側部７４とを有する形状（略Ｌ字型形状）をしている。その他の構成は実施例１と同じであるため説明を省略する。 11 (a) is a cross-sectional perspective view of the coil component 800 according to the eighth embodiment, and FIG. 11 (b) is a perspective view of the dummy terminal 66. As shown in FIGS. 11A and 11B, in the coil component 800 of the eighth embodiment, the dummy terminal 66 is connected to the lower portion 72 located on the lower surface 28 of the core 10 and the lower portion 72 located on the side surface 30. It has a shape (substantially L-shaped shape) having a side portion 74. Since other configurations are the same as those in the first embodiment, the description thereof will be omitted.

実施例１では、ダミー端子６０は、上部７０と下部７２と上部７０及び下部７２に連結した側部７４とを有する形状をし、実施例７では、ダミー端子６４は、上部７０と下部７２と上部７０及び下部７２に連結した３つの側部７４とを有する箱型形状をしている場合を例に示した。しかしながら、この場合に限られず、実施例８のように、ダミー端子６６は、下部７２と下部７２に連結した側部７４とを有する形状をしていてもよい。 In the first embodiment, the dummy terminal 60 has a shape having an upper portion 70, a lower portion 72, and a side portion 74 connected to the upper portion 70 and the lower portion 72, and in the seventh embodiment, the dummy terminal 64 has an upper portion 70 and a lower portion 72. An example is shown in the case of having a box shape having three side portions 74 connected to the upper portion 70 and the lower portion 72. However, the present invention is not limited to this case, and as in the eighth embodiment, the dummy terminal 66 may have a shape having a lower portion 72 and a side portion 74 connected to the lower portion 72.

図１２（ａ）は、実施例９に係る電子機器９００の平面図、図１２（ｂ）は、図１２（ａ）のＡ－Ａ間の断面図、図１２（ｃ）は、図１２（ａ）のＢ－Ｂ間の断面図である。図１２（ａ）から図１２（ｃ）のように、実施例９の電子機器９００は、例えばＤＣ－ＤＣコンバータであり、実施例１のコイル部品１００と、コイル部品１００が実装された回路基板９０と、を備える。 12 (a) is a plan view of the electronic device 900 according to the ninth embodiment, FIG. 12 (b) is a sectional view between A and A of FIG. 12 (a), and FIG. 12 (c) is FIG. 12 (c). It is sectional drawing between BB of a). As shown in FIGS. 12 (a) to 12 (c), the electronic device 900 of the ninth embodiment is, for example, a DC-DC converter, and the coil component 100 of the first embodiment and the circuit board on which the coil component 100 is mounted are mounted. 90 and.

コイル部品１００の外部端子４９ａは半田８０によって回路基板９０上の信号用のパッド９２ａに接続し、外部端子４９ｂは半田８０によって回路基板９０上の信号用のパッド９２ｂに接続している。ダミー端子６０の下部７２は半田８０によって回路基板９０上のグランド用のパッド９２ｃに接続している。コイル部品１００を回路基板９０に実装する場合では、端部４６ａ、４６ｂに設けられた半田８０がダミー端子６０の下部７２に設けられた半田８０よりも先に溶融する。これは、ダミー端子６０の下部７２のほとんどの部分が磁性体であるコア１０に接していることから、端部４６ａ、４６ｂに設けられた半田８０の方が速く温度が上昇するためである。パッド９２ａにはパッド９２ｂよりも高い電圧が印加される。例えば、パッド９２ａには５０Ｖの電圧が印加され、パッド９２ｂには５Ｖの電圧が印加される。 The external terminal 49a of the coil component 100 is connected to the signal pad 92a on the circuit board 90 by the solder 80, and the external terminal 49b is connected to the signal pad 92b on the circuit board 90 by the solder 80. The lower portion 72 of the dummy terminal 60 is connected to the ground pad 92c on the circuit board 90 by the solder 80. When the coil component 100 is mounted on the circuit board 90, the solder 80 provided at the ends 46a and 46b melts before the solder 80 provided at the lower portion 72 of the dummy terminal 60. This is because most of the lower portion 72 of the dummy terminal 60 is in contact with the core 10 which is a magnetic material, so that the solder 80 provided at the ends 46a and 46b raises the temperature faster. A voltage higher than that of the pad 92b is applied to the pad 92a. For example, a voltage of 50V is applied to the pad 92a, and a voltage of 5V is applied to the pad 92b.

このように、実施例９によれば、コア１０の上面２６側で螺旋状部４２から引き出された引出部４８ａの外部端子４９ａが接続されたパッド９２ａには、コア１０の下面２８側で螺旋状部４２から引き出された引出部４８ｂの外部端子４９ｂが接続されたパッド９２ｂよりも高い電圧が印加される。高い電圧が印加されるパッド９２ａに接続された引出部４８ａ側は、低い電圧が印加されるパッド９２ｂに接続された引出部４８ｂ側に比べて、発生する電界強度が大きい。このため、引出部４８ａがコア１０の上面２６側で螺旋状部４２から引き出されることで、大きな電界強度が発生する部位がダミー端子６０の上部７０の近くに配置されるようになり、電界を効果的にシールドすることができる。 As described above, according to the ninth embodiment, the pad 92a to which the external terminal 49a of the drawer portion 48a drawn from the spiral portion 42 is connected to the pad 92a on the upper surface 26 side of the core 10 is spiraled on the lower surface 28 side of the core 10. A voltage higher than that of the pad 92b to which the external terminal 49b of the drawer portion 48b drawn from the spiral portion 42 is connected is applied. The electric field strength generated on the drawer portion 48a side connected to the pad 92a to which a high voltage is applied is larger than that on the drawer portion 48b side connected to the pad 92b to which a low voltage is applied. Therefore, the extraction portion 48a is pulled out from the spiral portion 42 on the upper surface 26 side of the core 10, so that a portion where a large electric field strength is generated is arranged near the upper portion 70 of the dummy terminal 60, and the electric field is generated. Can be effectively shielded.

なお、実施例９では、電子機器９００は実施例１のコイル部品１００を備える場合を例に示したが、実施例２から実施例８のコイル部品を備える場合でもよい。 In Example 9, the electronic device 900 includes the coil component 100 of the first embodiment as an example, but the electronic device 900 may include the coil components of the second to eighth embodiments.

以上、本発明の実施例について詳述したが、本発明はかかる特定の実施例に限定されるものではなく、特許請求の範囲に記載された本発明の要旨の範囲内において、種々の変形・変更が可能である。 Although the examples of the present invention have been described in detail above, the present invention is not limited to such specific examples, and various modifications and variations are made within the scope of the gist of the present invention described in the claims. It can be changed.

１０ コア
１２ 上側コア
１４ 下側コア
１６ 上部
１７ 蓋部
１８ 下部
１９ 底部
２０～２０ｂ 側部
２２～２２ｂ 空洞
２４～２４ｂ 柱状部
２６ 上面
２８ 下面
３０ 側面
３２～３８ 辺
４０ コイル導体
４２ 螺旋状部
４４ａ、４４ｂ 接続部
４６ａ、４６ｂ 端部
４８ａ、４８ｂ 引出部
４９ａ、４９ｂ 外部端子
６０～６６ ダミー端子
７０ 上部
７２～７２ｂ 下部
７４ 側部
７６ 開口
８０ 半田
８２～８６ 接着剤
９０ 回路基板
９２ａ～９２ｃ パッド
１００～８００ コイル部品
９００ 電子機器 10 Core 12 Upper core 14 Lower core 16 Upper 17 Lid 18 Lower 19 Bottom 20-20b Side 22-22b Cavity 24-24b Columnar 26 Top 28 Bottom 30 Side 32-38 Side 40 Coil conductor 42 Spiral part 44a , 44b Connection part 46a, 46b End part 48a, 48b Drawer part 49a, 49b External terminal 60-66 Dummy terminal 70 Upper part 72-72b Lower part 74 Side part 76 Opening 80 Solder 82-86 Adhesive 90 Circuit board 92a-92c Pad 100 ~ 800 Coil parts 900 Electronic equipment

Claims (10)

下側コアと上側コアとが接合され、内部に柱状部と前記柱状部の周辺の空洞とを有するコアと、
前記柱状部の周囲に配置された螺旋状部と、前記螺旋状部から前記コアの下面となる前記下側コアの主外表面に向かって引き出され、前記コアの下面に平行で外部端子となる端部を含む引出部と、を有するコイル導体と、
前記コアに装着され、前記コアの下面に少なくとも設けられ、前記コイル導体と電気的に絶縁されたダミー端子と、を備え、
前記ダミー端子は、前記コアの下面に位置する下部と、前記螺旋状部を挟んで前記下面に対向する前記上側コアの主外表面である前記コアの上面に位置する上部と、前記下部と前記上部を連結する側部と、を有し、
前記ダミー端子は、前記ダミー端子の先端が前記外部端子よりも前記コアの下面の中心近くに位置するように、前記コアの下面の端から前記コアの下面の内側に延在し、
前記ダミー端子の前記コアの下面に位置する前記下部の総底面積は、前記外部端子の総底面積より大きい、コイル部品。 A core in which the lower core and the upper core are joined and has a columnar portion and a cavity around the columnar portion inside.
The spiral portion arranged around the columnar portion and the spiral portion are drawn from the spiral portion toward the main outer surface of the lower core, which is the lower surface of the core, and become an external terminal parallel to the lower surface of the core. A coil conductor having a drawer, including an end, and a
A dummy terminal mounted on the core, provided at least on the lower surface of the core, and electrically isolated from the coil conductor.
The dummy terminal has a lower portion located on the lower surface of the core, an upper portion located on the upper surface of the core which is the main outer surface of the upper core facing the lower surface with the spiral portion interposed therebetween, and the lower portion and the above. Has a side that connects the top,
The dummy terminal extends from the end of the lower surface of the core to the inside of the lower surface of the core so that the tip of the dummy terminal is located closer to the center of the lower surface of the core than the external terminal.
A coil component in which the total bottom area of the lower portion located on the lower surface of the core of the dummy terminal is larger than the total bottom area of the external terminal. 前記コイル導体の前記引出部のうちの前記螺旋状部と前記端部との間を接続する接続部は接着剤によって少なくとも前記コアに接着している、請求項１記載のコイル部品。 The coil component according to claim 1, wherein the connecting portion connecting the spiral portion and the end portion of the drawer portion of the coil conductor is adhered to at least the core with an adhesive. 前記コイル導体の前記外部端子は接着剤によって前記コアの下面に接着している、請求項１または２記載のコイル部品。 The coil component according to claim 1 or 2, wherein the external terminal of the coil conductor is adhered to the lower surface of the core by an adhesive. 複数の前記ダミー端子を備え、
前記コイル導体の前記外部端子は前記コアの下面のうちの第１辺側に配置され、前記複数のダミー端子それぞれの前記下部は前記コアの下面のうちの互いに対向する第２辺及び第３辺それぞれの側に配置されている、請求項１から３のいずれか一項記載のコイル部品。 Equipped with the plurality of dummy terminals
The external terminals of the coil conductor are arranged on the first side side of the lower surface of the core, and the lower portions of the plurality of dummy terminals are the second and third sides of the lower surface of the core facing each other. The coil component according to any one of claims 1 to 3, which is arranged on each side. 前記ダミー端子は、前記上部から前記側部に延在した開口を有し、前記開口に接着剤が充填されている、請求項１から４のいずれか一項記載のコイル部品。 The coil component according to any one of claims 1 to 4 , wherein the dummy terminal has an opening extending from the upper portion to the side portion, and the opening is filled with an adhesive. 前記ダミー端子は、前記下部と、前記上部と、前記下部と前記上部を連結する３つの前記側部と、を有し、前記コアを収納する開口を有する箱型形状をしている、請求項１から３のいずれか一項記載のコイル部品。 The dummy terminal has a lower portion, an upper portion, and three side portions connecting the lower portion and the upper portion, and has a box shape having an opening for accommodating the core. The coil component according to any one of Items 1 to 3. 前記ダミー端子は前記上部が前記下部よりも面積の大きな形状をしている、請求項１から６のいずれか一項記載のコイル部品。 The coil component according to any one of claims 1 to 6 , wherein the dummy terminal has a shape in which the upper portion has a larger area than the lower portion. 前記ダミー端子の前記上部は前記コアの上面全面を覆っている、請求項７記載のコイル部品。 The coil component according to claim 7 , wherein the upper portion of the dummy terminal covers the entire upper surface of the core. 請求項１から８のいずれか一項記載のコイル部品と、
前記コイル部品が実装された回路基板と、を備える電子機器。 The coil component according to any one of claims 1 to 8 and the coil component.
An electronic device comprising a circuit board on which the coil component is mounted. 前記コイル導体は２つの前記引出部を有し、
前記２つの引出部のうちの一方の引出部は前記コアの上面側で前記螺旋状部から引き出され、他方の引出部は前記コアの下面側で前記螺旋状部から引き出され、
前記一方の引出部の前記外部端子が接続された前記回路基板の第１パッドは、前記他方の引出部の前記外部端子が接続された前記回路基板の第２パッドよりも高い電圧が印加される、請求項９記載の電子機器。 The coil conductor has two of the drawers.
One of the two drawers is pulled out of the spiral on the upper surface side of the core, and the other drawer is pulled out of the spiral on the lower surface side of the core.
A higher voltage is applied to the first pad of the circuit board to which the external terminal of the one drawer is connected than to the second pad of the circuit board to which the external terminal of the other drawer is connected. , The electronic device according to claim 9 .
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US20190074130A1 (en) 2019-03-07
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US10755849B2 (en) 2020-08-25
US20180315542A1 (en) 2018-11-01

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