TW463191B - Monolithic capacitor - Google Patents

Monolithic capacitor Download PDF

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Publication number
TW463191B
TW463191B TW089125564A TW89125564A TW463191B TW 463191 B TW463191 B TW 463191B TW 089125564 A TW089125564 A TW 089125564A TW 89125564 A TW89125564 A TW 89125564A TW 463191 B TW463191 B TW 463191B
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Taiwan
Prior art keywords
monolithic
scope
patent application
item
ceramic capacitor
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TW089125564A
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Chinese (zh)
Inventor
Takuji Nakagawa
Yoshikazu Takagi
Yasunobu Yoneda
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Murata Manufacturing Co
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Publication of TW463191B publication Critical patent/TW463191B/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H01F2027/295—Surface mounted devices with flexible terminals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)

Abstract

A monolithic capacitor includes a plurality of monolithic ceramic capacitor elements provided with external electrodes at both ends thereof, solder layers arranged on the entire surfaces of the external electrodes of the monolithic ceramic capacitor elements, and metal terminals electrically connected to the external electrodes of the monolithic ceramic capacitor elements. The monolithic ceramic capacitor elements are joined to each other by the solder layers and are stacked on each other. The external electrodes of the monolithic ceramic capacitor elements are electrically connected to each other by the solder layers.

Description

經濟部智慧財產局員工消費合作社印製 五、發明說明（\ ) 發明背長 1. 發明領域 本發明係相關於單片式電容器，更特別地，本發明係 相關於一種具有高電容的單片式電容器，包括多個單片陶 瓷電容元件和金屬接線端，用作譬如鉬電解電容器的代用 品，用以平穩DC-DC變換器中的電源電路，或其他適宜的 用途。 2. 相關技術說明 爲了以保證彎曲強度及減輕熱應力改善熱衝擊電 阻，使用帶金屬接線端的單片式電容器。在這種單片式電 容器中，用金屬接線端支撐各單片陶瓷電容元件，以便不 與基板接觸。另外，如日本未審實用新型公開平-1-Π2032 中所述，使多個金屬接線端被彎曲。採用上述技術，還可 以減小高熱脹係數的基板，如鋁基板與各單片陶瓷電容元 件之間熱膨賬的差異。 在這種單片式電容器中，在形成多個單片陶瓷電容元 件時，利用導電樹脂或焊接劑，使各單片陶瓷電容元件的 外部電極彼此部分相連。 然而，有關這種單片陶瓷電容器，其中利用導電樹脂 或焊接劑，使各個單片陶瓷電容元件的外部電極，各接點 處的熱應力集中，而且各接點及單片陶瓷電容元件中可能 發生斷裂，造成靜電電容減小。 3 I T ^^1 n ^^1 I— -^1 ^^1 1 ^^1 I n 1^1 I l· * ] «^1 ^1» n ^^1 n 1 ^^1 ^^1 I 口 ^ (請先閱讀背面之注咅〕事項再填寫本頁) 本紙張尺度適用中國國家標準（CMS)A4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印製 463 1Γ A7 B7 五、發明說明（y) 發明摘要 爲了克服上述問題，本發明的較佳實施例提出一®^ 衝擊阻力高的單片式電容器，同時避免現有減少的所有^ 題。 按照本發明的各較佳實施例，一種單片式電容器包^舌 多個單片陶瓷電容元件，它們的兩端裝有外部電極’每個 單片陶瓷電容元件的外部電極的整個表面上佈置焊接層’ 與各單片陶瓷電容元件的外部電極電連接的金屬接線端° 各單片陶瓷電容元件互相疊置，並以焊接層互相連接’而 且單片陶瓷電容元件的外部電極以焊接層彼此電連接。 本發明之不同較佳實施例的單片式電容器中，最好金 屬接線端以焊焊層與至少一個單片陶瓷電容元件直接連 接。在這種情況下，各金屬接線端不能與其他的至少一個 單片陶瓷電容元件直接連接。 本發明不同較佳實施例的單片式電容器中，最好每個 金屬接線端包括中間部分，位於所述中間部分的一個邊緣 上的端部，它面向所述中間部分，其間有間隔，還包括位 於所述中間部分另一邊緣上的端部，其中所述端部將所述 金屬接線端賦予彈性，並以所述的焊接層與所述單片陶瓷 電容元件的外部電極相連。在這種情況下，可在金屬接線 端的內表面上形成阻礙焊接的膜層。 此外，本發明之不同較佳實施例的單片式電容器中， 在金屬接線端上有切口，用以調節電抗分量。 本發明之不同較佳實施例的單片式電容器中，由於各 4 本紙張尺度適用中國國家標準（CNS)A4規格（21〇 x 297公爱） -------------rv--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 4 63 191 A_ Λι _B7__ 五、發明說明（今） 單片陶瓷電容的外部電極的整個表面上佈置有所述焊層， 所以熱應力被所述焊層分散，並且防止各單片陶瓷電容元 件的接點中和各單片陶瓷電容元件發生熱裂。因此，本發 明較佳實施例的單片式電容器中的熱衝擊阻力大大得到改Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the Invention (1) Field of Invention The present invention relates to monolithic capacitors. More specifically, the present invention relates to a monolithic capacitor with high capacitance. Capacitors, including multiple monolithic ceramic capacitor elements and metal terminals, are used as substitutes for, for example, molybdenum electrolytic capacitors, to smooth power circuits in DC-DC converters, or other suitable applications. 2. Related technical description In order to ensure the bending strength and reduce the thermal stress to improve the thermal shock resistance, a monolithic capacitor with a metal terminal is used. In such a monolithic capacitor, each monolithic ceramic capacitor element is supported by a metal terminal so as not to contact the substrate. In addition, as described in Japanese Unexamined Utility Model Publication Hei-1-Π2032, a plurality of metal terminals are bent. With the above-mentioned technology, it is also possible to reduce the difference in thermal expansion between a substrate with a high thermal expansion coefficient, such as an aluminum substrate and each monolithic ceramic capacitor element. In such a monolithic capacitor, when a plurality of monolithic ceramic capacitor elements are formed, the external electrodes of the monolithic ceramic capacitor elements are partially connected to each other by using a conductive resin or a solder. However, with regard to such a monolithic ceramic capacitor, the thermal stress at each contact of the external electrodes of each monolithic ceramic capacitor element is concentrated by using conductive resin or solder, and each contact and monolithic ceramic capacitor element may Fracture occurs, resulting in reduced electrostatic capacitance. 3 IT ^^ 1 n ^^ 1 I—-^ 1 ^^ 1 1 ^^ 1 I n 1 ^ 1 I l · *] «^ 1 ^ 1» n ^^ 1 n 1 ^^ 1 ^^ 1 I Mouth ^ (Please read the note on the back first) and fill in this page) This paper size is applicable to Chinese National Standard (CMS) A4 (210 X 297 mm) Printed by the Intellectual Property Bureau Staff Consumer Cooperative of the Ministry of Economic Affairs 463 1Γ A7 B7 V. Description of the Invention (y) Summary of the Invention In order to overcome the above problems, a preferred embodiment of the present invention proposes a monolithic capacitor with high impact resistance, while avoiding all existing problems that have been reduced. According to the preferred embodiments of the present invention, a monolithic capacitor includes a plurality of monolithic ceramic capacitor elements, and external electrodes are mounted on both ends of the monolithic capacitor. The external electrodes of each monolithic ceramic capacitor element are arranged on the entire surface. Welding layer 'is a metal terminal that is electrically connected to the external electrode of each monolithic ceramic capacitor element. ° Each monolithic ceramic capacitor element is stacked on top of each other and connected to each other with a solder layer. Electrical connection. In the monolithic capacitor of the different preferred embodiments of the present invention, it is preferable that the metal terminal is directly connected to at least one monolithic ceramic capacitor element by a solder layer. In this case, each metal terminal cannot be directly connected to at least one other monolithic ceramic capacitor element. In the monolithic capacitors of the different preferred embodiments of the present invention, it is preferred that each metal terminal includes a middle portion, and an end located on one edge of the middle portion, which faces the middle portion with a space therebetween, and It includes an end portion located on the other edge of the middle portion, wherein the end portion imparts elasticity to the metal terminal and is connected to an external electrode of the monolithic ceramic capacitor element with the solder layer. In this case, a film preventing soldering may be formed on the inner surface of the metal terminal. In addition, in the monolithic capacitor of the different preferred embodiments of the present invention, a cutout is provided on the metal terminal for adjusting the reactance component. In the monolithic capacitors of the different preferred embodiments of the present invention, since each of the four paper sizes is in accordance with the Chinese National Standard (CNS) A4 specification (21 × x297), ------------ -rv -------- Order --------- line (please read the notes on the back before filling out this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 63 191 A_ Λι _B7__ V. Description of the Invention (Today) The solder layer is arranged on the entire surface of the external electrode of the monolithic ceramic capacitor, so the thermal stress is dispersed by the solder layer, and the contacts of the monolithic ceramic capacitor elements are prevented from neutralizing the individual monolithic capacitors. A chip ceramic capacitor was thermally cracked. Therefore, the thermal shock resistance in the monolithic capacitor of the preferred embodiment of the present invention is greatly improved.

Trinr 〇 從以下參照附圖詳細描述實施例，將使本發明的其他 特徵、元件、特點和優點更顯淸晰。 簡里圖示說明 圖1是本發明第一較佳實施例單片式電容器的透視 圖； 圖2是表示一個單片陶瓷電容元件的示意圖； 圖3是本發明第二較佳實施例單片式電容器的透視 圖； 圖4是第一比較例單片式電容器的透視圖； 圖5是表示圖4所示單片式電容器主要部分的裝配示 意圖； 圖6是第二比較例單片式電容器的透視圖： 圖7是本發明第三較佳實施例單片式電容器的透視 圖； 圖8是本發明第四較佳實施例單片式電容器的透視 圖； 圖9是本發明第五較佳實施例單片式電容器的透視 圖， 5 本纸張I度適用中國國ϋ準（CNS)A4規格（2]0 X 297公釐) _____________^ ________丁_________缘一I--' (請先閱讀背面之注意事項再填寫本頁) 4 63 1 9 A7 37 五、發明說明（斗*) 圖， 圖10是本發明第六較佳實施例單片式電容器的透視 圖u是第三比較例單片式電容器的透視圖； 圖12是本發明第七較佳實施例單片式電容器的透視 圖 眭濟部智慧財產局員工消費合作社印製 元件符號說明 單片式電容器 單片式電容器 單片陶瓷電容元件 疊層片 介電層 內部電極 20a Cu 層 20b Cu 層 22a Ni 層 22b Ni 層 24a Sn 層 24b Sn 層 30a金屬接線_ 3〇b金屬接線端 32a中間部分 32b中間部分 34a端部 34b端部 10 11 12 14 16 18 (請先閱讀背面之注意事項再填寫本頁) 訂----- 線丨 本紙張尺度適用中國1家標準（CNS)A4規格（210 X 297公釐） 463 1 五、發明說明) 36a端部 36b端部 38a膜層 38b膜層 40a 切口 40b 切口 銥住眚施例詳細說明 圖1是本發明第一較佳實施例單片式電容器的透視 圖。圖1中所示的單片式電容器10最好包括三個單片陶瓷 電容元件12。 如圖2所示，單片陶瓷電容元件12包括疊層片14。 疊層片14包括多個譬如由鈦酸鋇基之介電材料或其他適宜 的材料製成的介電層16，以及多個由諸如Ni等電極材料 或其他適宜的材料製成的內部電極18。多個介電層16和 多個內部電極18被交替地疊置。在這種情況下，使內部電 極18每隔一個排列成，延伸到疊層14的一側，同時保持 其他內部電極18排列成，使延伸至疊層14的另一側。在 疊層14 一側包含的一個端部上，依次安排Cu層20a、Ni 層22a和Sn層24a，構成外部電極。在這種情況下，在疊 層I4的一端加給厚度爲ΙΟΟμιη的Cu的糊劑，並在約150 °C條件下實行乾燥約10分鐘，隨之在8〇〇t條件下烘乾約 5分鐘，形成Cu層2〇a 〇繼而，利用濕法電鍍形成厚度約 Ιμηι的Ni層22a，並形成厚度約5μιη的Sn層24a。類似 7 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公髮) (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製Trinr 〇 Detailed description of the embodiments with reference to the accompanying drawings will make other features, elements, characteristics, and advantages of the present invention clearer. Brief Description of the Drawings Fig. 1 is a perspective view of a monolithic capacitor of a first preferred embodiment of the present invention; Fig. 2 is a schematic diagram showing a monolithic ceramic capacitor element; Fig. 3 is a monolithic of a second preferred embodiment of the present invention 4 is a perspective view of the monolithic capacitor of the first comparative example; FIG. 5 is an assembly schematic diagram showing the main part of the monolithic capacitor of FIG. 4; FIG. 6 is a monolithic capacitor of the second comparative example Perspective view: FIG. 7 is a perspective view of a third preferred monolithic capacitor of the present invention; FIG. 8 is a perspective view of a fourth preferred monolithic capacitor of the present invention; A perspective view of the monolithic capacitor of the preferred embodiment. 5 This paper I degree is applicable to China National Standard (CNS) A4 specifications (2) 0 X 297 mm. _____________ ^ ________ 丁 _________ Yuan Yi I-- ' (Please read the precautions on the back before filling this page) 4 63 1 9 A7 37 V. Description of the invention (bucket *) Figure, Figure 10 is a perspective view of a monolithic capacitor of the sixth preferred embodiment of the present invention. Perspective view of a monolithic capacitor of three comparative examples; FIG. 12 is a seventh preferred embodiment of the present invention Perspective view of monolithic capacitors. Printed components of the Ministry of Economic Affairs, Intellectual Property Bureau, Consumer Cooperatives. Symbol Description Monolithic capacitors. Monolithic capacitors. Monolithic ceramic capacitors. Laminated dielectric layers. Internal electrodes. 20a Cu layer 20b Cu layer 22a Ni layer 22b Ni layer 24a Sn layer 24b Sn layer 30a metal wiring_ 3〇b metal terminal 32a middle part 32b middle part 34a end 34b end 10 11 12 14 16 18 (Please read the precautions on the back before filling this page) Order ----- Line 丨 This paper size applies to a Chinese standard (CNS) A4 specification (210 X 297 mm) 463 1 V. Description of the invention) 36a end 36b end 38a film layer 38b film layer 40a cutout 40b cutout Detailed description of the embodiment of the iridium stilbene Figure 1 is a perspective view of a monolithic capacitor according to a first preferred embodiment of the present invention. The monolithic capacitor 10 shown in FIG. 1 preferably includes three monolithic ceramic capacitor elements 12. As shown in FIG. 2, the monolithic ceramic capacitor element 12 includes a laminated sheet 14. The laminated sheet 14 includes a plurality of dielectric layers 16 made of a barium titanate-based dielectric material or other suitable materials, and a plurality of internal electrodes 18 made of an electrode material such as Ni or other suitable materials. . A plurality of dielectric layers 16 and a plurality of internal electrodes 18 are alternately stacked. In this case, every other internal electrode 18 is arranged to extend to one side of the stack 14 while the other internal electrodes 18 are arranged to extend to the other side of the stack 14. On one end included on one side of the stack 14, a Cu layer 20a, a Ni layer 22a, and a Sn layer 24a are arranged in this order to constitute an external electrode. In this case, a paste with a thickness of 100 μm Cu was added to one end of the stack I4, and drying was performed at about 150 ° C for about 10 minutes, followed by drying at 800 t for about 5 minutes. Then, a Cu layer 20a is formed. Then, a Ni layer 22a having a thickness of about 1 μm is formed by wet plating, and a Sn layer 24a having a thickness of about 5 μm is formed. Similar to this paper size Applicable to China National Standard (CNS) A4 (210 X 297) (Please read the precautions on the back before filling out this page) Printed by the Employees ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs

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I 463 1 91 at B7 五、發明說明（6) 地，在包含疊層14另一側的另一端上，依次形成Cu層20b、 Ni層22b和Sn層24b ’構成外部電極。 如圖1所示，利用流動的焊接劑，將三個單片陶瓷電 容元件12與兩個最好由比如Fe-Cr合金製成的金屬接線端 30a和30b連在一起。 這就是說，金屬接線端30a包含平板狀中間部分^ 在中間部分32a的上邊緣佈置平板狀的端部34a，其面對 中間部分32a。端部34a與中間部分32a之間可開有間隙。 將端部3心的豎直長度最好約2.5mm ’這略長於單片陶瓷 電容元件12的高度。平板狀端部36a係置放在中間部分32a 的下邊緣，使其沿著基本上垂直於中間部分的方向延 伸。因此，端部3如將彈性傳遞給金屬接線端30a。金屬 接線端30a的外表面(即中間部分和端部34a的表面’ 除去彼此面對的表面之外，以及與之相連的端部36a的下 表面)受到焊料鍍層。另外，當容易被焊接的金屬接線端材 料採用比如黃銅時，金屬接線端30a的內表面（中間部分32a 和端部34a互相面對的表面，以及與之相連的端部36a的 上表面)上，形成阻礙焊接的膜層38a。膜層38a最好由比 如金屬氧化物、石蠟、樹脂或矽油或者其他適宜的材料製 成。類似地，另一個金屬接線端30b包含中間部分32b、 端部34b和端部36b，外表面受到焊料鍍層，而內表面上 形成阻礙焊接的膜層38b。 焊層26a和26b最好由高溫焊料，如由Pb:Sn=85:15 製得，它通過流動的焊劑分別佈置于三個單片陶瓷電容元 件12的外部電極(Sn層24a和24b)的整個表面上。三個單 8 (請先閒讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 訂---------線L-------------------- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印製 4 63 1 9 ? a? _ B7 五、發明說明（9) 片陶瓷電容元件12互相重疊並利用焊層24a和24b彼此連 接，而且各外部電極彼此電連接，而且，金屬接線端30a 和30b的端部34a和端部34b連到下部單片陶瓷電容元件 12的外部電極。 圖3是根據本發明第二較佳實施例單片式電容器的立 體圖。圖3所示單片式電容器10不同於圖！所示的單片式 電容器10，金屬接線端30a和30b的端部34a和34b的縱 向長度最好約7.0mm，這實質上等於連在一起的三個單片 陶瓷電容元件I2的高度。因此，金屬接線端30a和30b的 中間部分32a和32b的縱向長度比較長。利用焊層26a和 26b，使金屬接線端30a和30b的端部34a和34b與三個單 片陶瓷電容元件12的外部電極相連。 圖4是第一比較例單片式電容器的透視圖，而圖5是 表示圖4所示單片式電容器主要部分的裝配示意圖。在圖 4所示的單片式電容器π中，與圖1所示的單片式電容器 10比較，只將焊劑25a和25b(參見圖5)加到三個單片陶瓷 電容元件12的外部電極互相面對的部分，而且再使用Fe-Cr合金製成的金屬接線端30a和30b與單片陶瓷電容元件 12相連。因此，焊層26a和26b只佈置于三個單片陶瓷電 容元件12的外部電極互相面對的部分和各外部電極與金屬 接線端彼此面對的部分上。 圖6是根據第二比較例單片式電容器的立體圖。圖6 中所示的單片式電容器U與圖3所示的單片式電容器10 相比，只將焊劑加于三個單片陶瓷電容元件U的外部電極 互相面對的部分，然後再使由Fe-Cr合金製成的金屬接線 9 本紙張尺度適用中國國家標準（CNS)A4規格 (210 X 297公楚） 11 ^^1 ^^1 ^^1 ^^1 iflv I ^ ^^1 n ^^1 ^^1 ^^1 ^^1 τι'I ^^1 ^flv ϋ li in n» I I if ? \-^=°女，'·7 (請先閱讀背面之注意事項再填寫本貝) 4 63 1 91 五、發明說明（j ) (請先閱讀背面之;i意事項再填寫本頁) 端30a和30b與各單片陶瓷電容元件12相連。因此，焊層 26a和20b佈置于三個單片陶瓷電容元件12的外部電極互 相面對的部分以及底部單片陶瓷電容元件12的外部電極與 金屬接線端互相面對的部分。 按照本發明第一與第二較佳實施例以及第一與第二比 較例所示例結構的單片式電容器，最好每一個都裝在鋁基 板上，觀察熱衝擊的迴圈特性，結果示於表1中。其中， 硏究有關於在使用250次迴圈周期的熱衝擊和使用500次 迴圈周期的熱衝擊情況下的熱衝擊迴圈特性中之故障率(故 障次數/總次數），這當中從-55°C至125°C的熱變化是一次 熱衝擊迴圏周期。大於或等於10%的靜電容變化(減小)即 被認爲是故障。 表 1 g屬接線端端 部長度(mm) 金屬接線 端的材料 熱衝擊迴圈特性(故障次數/總次 數） 250次迴圈 500次迴圈 實例1(圖1) 2.5 Fe-Cr 0/36 0/36 實例2(圖3) 7.0 Fe-Cr 0/36 0/36 比較例1(圖 4) 2.5 Fe-Cr 2/36 16/36 比較例2(圖 6) 7.0 Fe-Cr 2/36 10/36 經濟部智慧財產局員工消費合作社印製 有如從表1所能看到的，按照本發明第一與第二較佳 實施例構成的實例1和實例2中的焊層係佈置於各單片陶 10 本紙張&度適用中國國家標準（CNSM4規格（210 X 297公釐） 463 1 Λ7 B7 五、發明說明（^) 瓷電容元件的外部電極的整個表面上，由熱衝擊引起的故 障次數爲0。相反的，比較例1和比較2中的焊層部分地 形成于各單片陶瓷電容元件的外部電極的表面上，會發生 因熱衝擊引起的故障。 所得到的結果原因在於，當各單片陶瓷電容元件的外 部電極彼此通過焊層局部連接時，在熱衝擊試驗中，有熱 應力集中在接點處，在接點和各單片陶瓷電容元件內會發 生斷裂，同時引起靜電容減小。相反，當各單片陶瓷電容 元件的外部電極的整個表面上佈置焊層時，會通過焊層而 分散熱應力，防止在各單片陶瓷電容元件與單片陶瓷電容 元件的接點處發生熱裂，從而改善熱衝擊阻力。 另如上面的實例1和2所述，當在各單片陶瓷電容元 件的外部電極的整個表面上佈置焊層時，由於各單片陶瓷 電容元件的連接強度大大提高，所以無需形成金屬接線端 在相應於被連在一起的單片陶瓷電容元件的外部電極。 此外，有如上面的實例1和2所述，由於金屬接線端 的端部將彈性傳遞給金屬接線端，就能減小其上安裝所述 單片式電容器的基板與各單片陶瓷電容元件之間熱膨脹的 差異。並且，由於在金屬接線端的內表面上形成阻礙焊接 的膜層，所以不會因焊劑附於金屬接線端的內表面削弱金 屬接線端的弾性° 圖7是根據本發明第三較佳實施例單片式電容器的立 體圖。圖7中所示的單片式電容器的結構與圖1所示單 片式電容器10的結構本質上相同° (請先閱讀背面之注意事項再填窝本頁) 經濟部智慧財產局員工消費合作社印製 n it n n h°J n n I I n I n ^ I I i I I I n tl· t i— n 本紙張尺度適用中囤囷家標準（CNS)A4規格（210 X 297公釐） 4 63 1 Γ ; Λ7 Β7 五、發明說明（/0) 圖8是根據本發明第四較佳實施例單片式電容器的立 體圖。圖8中所示的單片式電容器10不同於圖7中所示的 單片式電容器10，最好由Fe-Cr合金製成的金屬接線端30a 和30b的端部34a和34b的縱向長度約 5.1mm，這實質 上等於連在一起的兩個單片陶瓷電容元件12的高度。因 此，金屬接線端30a和30b的中間部分32a和32b的縱向 長度比較長。 圖9是本發明第五較佳實施例單片式電容器的立體 圖。圖9中所示的單片式電容器10的結構最好本質上與圖 3所示單片式電容器10的結構相同。 圖10是本發明第六較佳實施例單片式電容器的立體 圖。圖10中所示的單片式電容器10不同於圖9中所示的 單片式電容器10，金屬接線端30a和30b的端部34a和34b 的縱向長度約 10.1mm，這長於連在一起的三個單片陶瓷 電容元件12的高度。因此，中間部分32a和32b的縱向長 度比較長。 圖11是第三比較例單片式電容器的透視圖。在圖11 所示的單片式電容器11中，相比圖7至10中所示的單片 式電容器10，沒有金屬接線端30a和30b。 對於本發明較佳實施例3、4、5和6以及比較例3中 所示例結構的單片式電容器，測量等效串聯電阻(ESR)和等 效串聯電感(ESL)，當把每個單片式電容器裝於環氧玻璃基 板上時，測量偏差，而且在把每個單片式電容器裝於鋁基 板上時，測量熱衝擊迴圈特性。它們的結果被示於表2中。 12 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注t事項再填寫本頁) --------訂·--------) '' 經濟部智慧財產局員工消費合作社印製 Α7 4 63 1 λ 五、發明說明（/'/) 在100kHz和400kHz下測量ESR，而在10MHz下測量ESL。 對於熱衝擊迴圏特性’硏究了在使用250次熱衝擊迴圈周 期情況下的故障率(故障次數/試驗總次數），其中從—^^至 125°C的熱變化是一次熱衝擊迴圈周期。大於或等於1〇%的 靜電容變化(減小)即被認爲是故障。 表 2 金屬接線 端端部的 m fmm) 金屬接 線端的 材料 100kHz 下的 ESR (ιηΩ) 400kHz 下的 ESR (ιηΩ) 10MH z下的 ESL (nH) 偏差 (mm) 熱衝擊迴圈特 性(故障次數/ 總次數） 實例 3(11 7) 2.5 Fe-Cr 5.9 6.4 1.3 4.2 0/36 實例 4(圖 8) 5.1 Fe-Cr 7.2 7.6 1.6 7或更大 0/36 實例 5(圖 9) 7.0 Fe-Cr 9.0 9.8 2.0 7或更大 0/36 實例 6(Hl〇) 10.1 Fe-Cr 15.0 15.9 3.2 7或更大 0/36 比較例 3_11) 3.0 0.1 0.8 1.5 36/36 有如從表2所能看到的，當使用由Fe-Cr合金製成的 金屬接線端時’通過將金屬接線卿的陆部長度設定爲 5,1娜，使ESR和ESL·的增大減至ij最小’並可使故障及熱 衝擊迴圈特性大大改善。 對於實例3、4、5和6以及比較例3中的單片式電容 13 本紙張尺度適用中國國家標準（CNS)A4規格（210x297公釐） 丁 _ I 111 — — — — i t (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 463 191 A7 ____________________ B7 ___..... - — _ _ 五、發明說明（/>) 器，其中的金屬接線端由黃銅製成，測量ESR和ESL，當 把每個單片式電容器裝於環氧玻璃基板上時，_量偏差， 並在把每個單片式電容器裝於鋁基板上時，測摄熱衝擊迴 圈特性。它們的結果被示於表3中。 金屬接線 端端部的 m (mm) 金屬接 線端的 材料 100kHz 下的 ESR (ιηΩ) 400kHz 下的 ESR (ιηΩ) 10ΜΗ z下的 ESL (nH) 偏差 (mm) 熱衝擊迴圈特 性(故障次數/ 總次數） 實例 3(圖 7) 2.5 黃銅 3.3 3.1 1.0 4.2 2/36 實例 4(圖 8) 5.1 黃銅 3.6 3.1 1.2 7或更大 0/36 實例 5(圖 9) 7.0 黃銅 3.7 3.1 1.5 7或更大 0/36 實例 6(ffll〇) 10.1 黃銅 4.8 3.1 2.2 7或更大 0/36 比較例 3圖11) 3.0 0.1 0.8 1.5 36/36 有如從表3所能看到的，當使用由黃銅製成的金屬接 線端時，雖然熱衝擊迴圈特性略爲下降，但可使ESR進一 步減小。 在上述各單片式電容器中’如果加大金屬接線端的長 度，則ESR和ESL增大，這是有害的。因此，最好將金屬 14 本紙張尺度適用中囤國家標準（CNS)A4規格（2〗0 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 •jwi i I I f I n n ϋ n n n It n It >1 _»Ni nir-OJ» I n. ^ 1 n. ^ 1 I nnn —III .I nnnn I--nt— n LI It n. I 463 1 91 at B7 V. Description of the invention (6) On the other end of the other side of the layer 14, a Cu layer 20b, a Ni layer 22b, and a Sn layer 24b 'are sequentially formed to constitute an external electrode. As shown in Fig. 1, three monolithic ceramic capacitor elements 12 are connected to two metal terminals 30a and 30b, preferably made of, for example, Fe-Cr alloy, using a flowing solder. That is, the metal terminal 30a includes a flat plate-shaped middle portion. A flat plate-shaped end portion 34a is arranged on the upper edge of the middle portion 32a, and faces the middle portion 32a. A gap may be formed between the end portion 34a and the intermediate portion 32a. The vertical length of the center of the end portion 3 is preferably about 2.5 mm ', which is slightly longer than the height of the monolithic ceramic capacitor element 12. The flat end portion 36a is placed on the lower edge of the middle portion 32a so as to extend in a direction substantially perpendicular to the middle portion. Therefore, the end portion 3 transmits elasticity to the metal terminal 30a. The outer surface of the metal terminal 30a (i.e., the surface of the intermediate portion and the end portion 34a except the surface facing each other and the lower surface of the end portion 36a connected thereto) is subjected to solder plating. In addition, when the material of the metal terminal that is easily welded is, for example, brass, the inner surface of the metal terminal 30a (the surface where the middle portion 32a and the end portion 34a face each other, and the upper surface of the end portion 36a connected to it) On this, a film layer 38a that prevents soldering is formed. The film layer 38a is preferably made of, for example, metal oxide, paraffin, resin or silicone oil or other suitable materials. Similarly, the other metal terminal 30b includes a middle portion 32b, an end portion 34b, and an end portion 36b, the outer surface is subjected to solder plating, and the inner surface is formed with a film layer 38b that prevents soldering. The solder layers 26a and 26b are preferably made of high-temperature solder, such as made of Pb: Sn = 85: 15, which are respectively arranged on the external electrodes (Sn layers 24a and 24b) of the three monolithic ceramic capacitor elements 12 by flowing flux. On the entire surface. Three slips 8 (please read the precautions on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -------- line L ----------- --------- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 63 1 9? A? _ B7 V. Invention Explanation (9) The ceramic capacitor elements 12 overlap each other and are connected to each other by the solder layers 24a and 24b, and the external electrodes are electrically connected to each other, and the end portions 34a and 34b of the metal terminals 30a and 30b are connected to the lower single piece. External electrode of the ceramic capacitor element 12. Fig. 3 is a perspective view of a monolithic capacitor according to a second preferred embodiment of the present invention. The monolithic capacitor 10 shown in FIG. 3 is different from the figure! The illustrated monolithic capacitor 10 preferably has a longitudinal length of the ends 34a and 34b of the metal terminals 30a and 30b of about 7.0 mm, which is substantially equal to the height of the three monolithic ceramic capacitor elements I2 connected together. Therefore, the middle portions 32a and 32b of the metal terminals 30a and 30b have a longer length in the longitudinal direction. The end portions 34a and 34b of the metal terminals 30a and 30b are connected to the external electrodes of the three monolithic ceramic capacitor elements 12 by the solder layers 26a and 26b. FIG. 4 is a perspective view of the monolithic capacitor of the first comparative example, and FIG. 5 is an assembly diagram showing the main parts of the monolithic capacitor shown in FIG. In the monolithic capacitor π shown in FIG. 4, in comparison with the monolithic capacitor 10 shown in FIG. 1, only the fluxes 25 a and 25 b (see FIG. 5) are added to the external electrodes of the three monolithic ceramic capacitor elements 12. The portions facing each other, and metal terminals 30a and 30b made of Fe-Cr alloy are connected to the monolithic ceramic capacitor element 12. Therefore, the solder layers 26a and 26b are disposed only on portions where the external electrodes of the three monolithic ceramic capacitor elements 12 face each other and portions where the external electrodes and metal terminals face each other. FIG. 6 is a perspective view of a monolithic capacitor according to a second comparative example. Compared with the monolithic capacitor 10 shown in FIG. 3, the monolithic capacitor U shown in FIG. 6 is applied with solder only to the portions where the external electrodes of the three monolithic ceramic capacitive elements U face each other, and then Metal wiring made of Fe-Cr alloy 9 This paper size applies to China National Standard (CNS) A4 (210 X 297 Gongchu) 11 ^^ 1 ^^ 1 ^^ 1 ^^ 1 iflv I ^ ^^ 1 n ^^ 1 ^^ 1 ^^ 1 ^^ 1 τι'I ^^ 1 ^ flv ϋ li in n »II if? \-^ = ° Female, '· 7 (Please read the notes on the back before filling in this shell ) 4 63 1 91 V. Description of the invention (j) (Please read the back of the page; I will fill out this page before filling in this page) The terminals 30a and 30b are connected to each monolithic ceramic capacitor element 12. Therefore, the solder layers 26a and 20b are arranged at portions where the external electrodes of the three monolithic ceramic capacitor elements 12 face each other and where the external electrodes of the bottom monolithic ceramic capacitor element 12 and the metal terminals face each other. The monolithic capacitors according to the structures of the first and second preferred embodiments of the present invention and the first and second comparative examples are each preferably mounted on an aluminum substrate, and the loop characteristics of thermal shock are observed, and the results are shown. In Table 1. Among them, the failure rate (the number of failures / total number) in the thermal shock loop characteristics in the case of using thermal shocks of 250 cycles and thermal shocks of 500 cycles is studied, from- The thermal change from 55 ° C to 125 ° C is a thermal shock recovery cycle. A capacitance change (decrease) of 10% or more is considered a fault. Table 1 g belongs to the end length of the terminal (mm) The thermal shock loop characteristics of the metal terminal material (faults / total number) 250 cycles 500 cycles Example 1 (Figure 1) 2.5 Fe-Cr 0/36 0 / 36 Example 2 (Figure 3) 7.0 Fe-Cr 0/36 0/36 Comparative Example 1 (Figure 4) 2.5 Fe-Cr 2/36 16/36 Comparative Example 2 (Figure 6) 7.0 Fe-Cr 2/36 10 / 36 The Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs printed as shown in Table 1. The solder layers in Examples 1 and 2 constructed according to the first and second preferred embodiments of the present invention are arranged in each order. 10 pieces of pottery paper & degree applicable to Chinese national standard (CNSM4 specification (210 X 297 mm) 463 1 Λ7 B7 V. Description of the invention (^) Failure caused by thermal shock on the entire surface of the external electrode of the ceramic capacitor element The number of times is 0. In contrast, the solder layers in Comparative Examples 1 and 2 were partially formed on the surface of the external electrodes of each monolithic ceramic capacitor element, and a failure due to thermal shock occurred. The result was obtained because When the external electrodes of each monolithic ceramic capacitor element are locally connected to each other through a solder layer, there is a thermal stress in the thermal shock test. The force is concentrated at the contact point, and breakage occurs in the contact point and each monolithic ceramic capacitor element, and at the same time, the electrostatic capacitance decreases. On the contrary, when a solder layer is arranged on the entire surface of the external electrode of each monolithic ceramic capacitor element, The thermal stress will be dispersed through the solder layer to prevent thermal cracking at the contact point between each monolithic ceramic capacitor element and the monolithic ceramic capacitor element, thereby improving the thermal shock resistance. Also as described in Examples 1 and 2 above, when the When a solder layer is arranged on the entire surface of the external electrode of each monolithic ceramic capacitor element, since the connection strength of each monolithic ceramic capacitor element is greatly improved, it is not necessary to form a metal terminal corresponding to the monolithic ceramic capacitor element connected together. In addition, as described in Examples 1 and 2 above, since the ends of the metal terminals transmit elasticity to the metal terminals, the substrate on which the monolithic capacitors are mounted and the monolithic ceramics can be reduced. The difference in thermal expansion between capacitor elements. Also, since a film that prevents soldering is formed on the inner surface of the metal terminal, it will not be attached to the metal The inner surface of the terminal weakens the rigidity of the metal terminal. Fig. 7 is a perspective view of a monolithic capacitor according to a third preferred embodiment of the present invention. The structure of the monolithic capacitor shown in Fig. 7 and the monolithic capacitor 10 shown in Fig. 1 The structure is essentially the same ° (Please read the notes on the back before filling in this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs n it nnh ° J nn II n I n ^ II i III n tl · ti— n This paper is applicable to the CNS A4 specification (210 X 297 mm) 4 63 1 Γ; Λ7 B7 5. Description of the invention (/ 0) Figure 8 is a single chip according to the fourth preferred embodiment of the present invention Perspective view of the capacitor. The monolithic capacitor 10 shown in FIG. 8 is different from the monolithic capacitor 10 shown in FIG. 7, and preferably has a longitudinal length of the ends 34 a and 34 b of the metal terminals 30 a and 30 b made of Fe-Cr alloy. About 5.1 mm, which is substantially equal to the height of two monolithic ceramic capacitor elements 12 connected together. Therefore, the lengths of the middle portions 32a and 32b of the metal terminals 30a and 30b are relatively long. Fig. 9 is a perspective view of a monolithic capacitor according to a fifth preferred embodiment of the present invention. The structure of the monolithic capacitor 10 shown in Fig. 9 is preferably substantially the same as the structure of the monolithic capacitor 10 shown in Fig. 3. Fig. 10 is a perspective view of a monolithic capacitor according to a sixth preferred embodiment of the present invention. The monolithic capacitor 10 shown in FIG. 10 is different from the monolithic capacitor 10 shown in FIG. 9. The lengths of the ends 34 a and 34 b of the metal terminals 30 a and 30 b are about 10.1 mm, which is longer than those connected together. The height of three monolithic ceramic capacitor elements 12. Therefore, the longitudinal lengths of the middle portions 32a and 32b are relatively long. 11 is a perspective view of a third comparative example monolithic capacitor. In the monolithic capacitor 11 shown in Fig. 11, compared with the monolithic capacitor 10 shown in Figs. 7 to 10, there are no metal terminals 30a and 30b. For the monolithic capacitors of the structures shown in the preferred embodiments 3, 4, 5, and 6 of the present invention and Comparative Example 3, the equivalent series resistance (ESR) and equivalent series inductance (ESL) are measured. When a chip capacitor is mounted on an epoxy glass substrate, the deviation is measured, and when each monolithic capacitor is mounted on an aluminum substrate, the thermal shock loop characteristics are measured. Their results are shown in Table 2. 12 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the note on the back before filling this page) -------- Order · ------ -) '' Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs A7 4 63 1 λ 5. Description of the invention (/ '/) The ESR is measured at 100kHz and 400kHz, and the ESL is measured at 10MHz. Regarding the thermal shock return characteristics, the failure rate (the number of failures / the total number of tests) in the case of using 250 thermal shock loop cycles is studied, in which the thermal change from-^^ to 125 ° C is a thermal shock return Circle cycle. A capacitance change (decrease) of 10% or more is considered a fault. Table 2 m fmm at the end of the metal terminal) Material of the metal terminal ESR at 100kHz (ιηΩ) ESR at 400kHz (ιηΩ) ESL (nH) deviation at 10MHZ (mm) Thermal shock loop characteristics (number of failures / Total times) Example 3 (11 7) 2.5 Fe-Cr 5.9 6.4 1.3 4.2 0/36 Example 4 (Figure 8) 5.1 Fe-Cr 7.2 7.6 1.6 7 or greater 0/36 Example 5 (Figure 9) 7.0 Fe-Cr 9.0 9.8 2.0 7 or greater 0/36 Example 6 (HlO) 10.1 Fe-Cr 15.0 15.9 3.2 7 or greater 0/36 Comparative Example 3_11) 3.0 0.1 0.8 1.5 36/36 As can be seen from Table 2 When using a metal terminal made of Fe-Cr alloy, 'by setting the land length of the metal wiring secretary to 5,1 nanometer, the increase of ESR and ESL · is minimized to ij' and the failure and Thermal shock loop characteristics are greatly improved. For the monolithic capacitors 13 in Examples 3, 4, 5, and 6 and Comparative Example 3, this paper size applies the Chinese National Standard (CNS) A4 specification (210x297 mm) D_ I 111 — — — — it (Please read first Note on the back, please fill in this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 463 191 A7 ____________________ B7 ___.....--_ _ V. Description of the invention (/ >) Made of brass, measuring ESR and ESL, measuring the deviation when each monolithic capacitor is mounted on an epoxy glass substrate, and measuring when each monolithic capacitor is mounted on an aluminum substrate Thermal shock loop characteristics. Their results are shown in Table 3. M (mm) of metal terminal end Material of metal terminal ESR (ιηΩ) at 100kHz ESR (ιηΩ) at 400kHz ESL (nH) deviation at 10MHz (mm) Thermal shock loop characteristics (number of failures / total Frequency) Example 3 (Figure 7) 2.5 Brass 3.3 3.1 1.0 4.2 2/36 Example 4 (Figure 8) 5.1 Brass 3.6 3.1 1.2 7 or greater 0/36 Example 5 (Figure 9) 7.0 Brass 3.7 3.1 1.5 7 Or greater 0/36 Example 6 (ffll〇) 10.1 Brass 4.8 3.1 2.2 7 or greater 0/36 Comparative Example 3 Figure 11) 3.0 0.1 0.8 1.5 36/36 As can be seen from Table 3, when used With metal terminals made of brass, although the thermal shock loop characteristics are slightly reduced, the ESR can be further reduced. Among the above monolithic capacitors, if the length of the metal terminal is increased, the ESR and ESL increase, which is harmful. Therefore, it is best to apply the National Standard (CNS) A4 specification (2) 0 X 297 mm for 14 paper sizes (please read the precautions on the back before filling this page), the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperatives Printing • jwi i II f I nn ϋ nnn It n It > 1 _

五、發明說明（/+3) 接線端的長度設定得盡可能短。另一方面，對於DC-DC轉 換器的反饋控制電路，在所要調解的頻帶內，ESR最好是 恒定的’大致在幾毫歐姆到10毫歐姆。如果採用本發明各 較佳實施例的單片式電容器及其製作方法，可以大大減小 金屬接線端的長度，並可通過調節金屬接線端的長度進行 精確地調解和控制，以滿足上述條件。 這就是說，按照本發明各較佳實施例，可將金屬接線 端的長度設定成熱衝擊迴圏特性和彎曲強度所需的最小 値，並可使ESR和ESL大大減小。本發明各較佳實施例通 過調整金屬接線端的電阻及長度，可以較爲容易且準確地 製成具有所需ESR的單片式電容器。 圖12是本發明第七較佳實施例單片式電容器的立體 圖。圖12中所示的單片式電容器1〇不同於圖1中所示的 單片式電容器10,沿金屬接線端30a和30b的中間部分32a 和32b寬度方向，在靠近中心處分別設置切口 40a和40b。 通過在金屬接線端30a和30b中設置切口 40a和4〇b，可 使金屬接線端30a和30b的電抗分量得到調節。此外，如 圖12所示，在金屬接線端30a內，由切口 40a分開的端部 36a的第一部分，以及第二部分分別與圖樣電極P1和P2 相連，而在金屬接線端30b內，由切口 40b分開的端部36b 的第一部分，以及第二部分分別與圖樣電極P3和P4相連。 由於在被金屬接線端30b(30a)的切口 40b(4〇a)分開的中間 部分32b(32a)的第一部分與第二部分中的電流沿相反方流 動，使磁通量互相抵消，從而可使ESL大大減小。另外， (請先閱讀背面之注意事項再填寫未頁) -n n n n 一nJ n n n n ill I n < 經濟部智慧財產局員工消費合作杜印製 本紙張尺度適用中國國家標準（CNS)A‘l規格（210 X 297公釐） A7 46^ 01 五、發明說明（ί午） 所述切口 40a和40b並非一定要形成於金屬接線端30a和 30b的中間部分32a與32b的靠近中心處，而是可以彤成 於金屬接線端30a和30b的其他區域。並且，可以形成多 個切口。 雖然上述各較佳實施例的示例中均採用三個單片陶瓷 電容元件，但本發明中也可採用兩個或者四個以上單片陶 瓷電容元件。 雖然上述各較佳實施例所示例的單片陶瓷電容元件的 外部電極均有包含Cu層、Ni層和Sn層的三層結構，不過 所述外部電極也可有其他結構，只要它是可以焊接的即可。 此外，本發明的各較佳實施例中，爲了提高多個單片 陶瓷電容元件之間的結合強度，可將結合用的樹脂嵌入各 單片陶瓷電容元件之間的靠近中心處。 金屬接線端的材料不限於Fe-Cr合金或黃銅，也可採 用Ag、Ni、Cu、Fe和Cr，或它們的合金，或者其他適宜 的材料。 按照本發明各較佳實施例，可以得到具有高熱衝擊阻 力的單片式電容器。另外，本發明各較佳實施例還可避免 增大ESR和ESL。 雖然本發明已經由參照較佳實施例說明之，但按照上 述示範，本發明的很多修改和變化都是可能的。因此，將 能理解，在所附申請專利範圍內，除了有如所特別敘述的， 本發明還可以其他方式實現。 16 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製5. Description of the invention (/ + 3) The length of the terminal is set as short as possible. On the other hand, for the feedback control circuit of the DC-DC converter, in the frequency band to be tuned, the ESR is preferably constant ', which is approximately several milliohms to 10 milliohms. If the monolithic capacitors and manufacturing methods of the preferred embodiments of the present invention are adopted, the length of the metal terminal can be greatly reduced, and the metal terminal can be adjusted and controlled accurately by adjusting the length of the metal terminal to meet the above conditions. That is, according to the preferred embodiments of the present invention, the length of the metal terminal can be set to the minimum required for thermal shock recovery characteristics and bending strength, and the ESR and ESL can be greatly reduced. In the preferred embodiments of the present invention, by adjusting the resistance and length of the metal terminal, a monolithic capacitor having a desired ESR can be easily and accurately manufactured. Fig. 12 is a perspective view of a monolithic capacitor according to a seventh preferred embodiment of the present invention. The monolithic capacitor 10 shown in FIG. 12 is different from the monolithic capacitor 10 shown in FIG. 1. In the width direction of the middle portions 32 a and 32 b of the metal terminals 30 a and 30 b, cutouts 40 a are provided near the center, respectively. And 40b. By providing the cutouts 40a and 40b in the metal terminals 30a and 30b, the reactance components of the metal terminals 30a and 30b can be adjusted. In addition, as shown in FIG. 12, in the metal terminal 30a, the first portion and the second portion of the end portion 36a separated by the cutout 40a are connected to the pattern electrodes P1 and P2, respectively, and in the metal terminal 30b, the cutout The first portion and the second portion of the separated end portion 36b of 40b are connected to the pattern electrodes P3 and P4, respectively. Since the current in the first part and the second part of the middle part 32b (32a) separated by the cutout 40b (40a) of the metal terminal 30b (30a) flows in opposite directions, the magnetic fluxes cancel each other, so that ESL can be made. Greatly reduced. In addition, (please read the precautions on the back before filling in the unpage) -nnnn-nJ nnnn ill I n < Consumption Cooperation between Employees and Intellectual Property Bureau of the Ministry of Economic Affairs Du printed This paper is compliant with China National Standard (CNS) A'l specifications (210 X 297 mm) A7 46 ^ 01 V. Description of the invention (ί 午) The cuts 40a and 40b are not necessarily formed near the centers of the middle portions 32a and 32b of the metal terminals 30a and 30b, but may be It is formed in other areas of the metal terminals 30a and 30b. Also, multiple cuts can be made. Although three monolithic ceramic capacitors are used in the examples of the above-mentioned preferred embodiments, two or more monolithic ceramic capacitors may be used in the present invention. Although the external electrodes of the monolithic ceramic capacitor element illustrated in each of the above preferred embodiments have a three-layer structure including a Cu layer, a Ni layer, and a Sn layer, the external electrode may have other structures as long as it is solderable Just fine. In addition, in the preferred embodiments of the present invention, in order to improve the bonding strength between a plurality of monolithic ceramic capacitor elements, a resin for bonding may be embedded near the center between the monolithic ceramic capacitor elements. The material of the metal terminal is not limited to Fe-Cr alloy or brass, but Ag, Ni, Cu, Fe, and Cr, or an alloy thereof, or other suitable materials may be used. According to the preferred embodiments of the present invention, a monolithic capacitor having a high thermal shock resistance can be obtained. In addition, the preferred embodiments of the present invention can avoid increasing the ESR and ESL. Although the present invention has been described with reference to the preferred embodiments, many modifications and variations of the present invention are possible in accordance with the above-mentioned examples. Therefore, it will be understood that the invention may be implemented in other ways within the scope of the attached patent application, except as specifically described. 16 (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs

-^^1 ^^1 ^^1 ^^1 ^^1 ^^1 丨 MHb ΜΑΙΑ Μ·· _ ^ 1^1 i n ^1· ^^1 ^^1 ^^1 n n n ^^1 m ^^1 I 本紙張尺度適用中國國家標準（CNS)A.:1規格（210 X 297公复）-^^ 1 ^^ 1 ^^ 1 ^^ 1 ^^ 1 ^^ 1 丨 MHb ΜΑΙΑ Μ ·· _ 1 ^ 1 in ^ 1 · ^^ 1 ^^ 1 ^^ 1 nnn ^^ 1 m ^^ 1 I This paper size applies to China National Standard (CNS) A.:1 specifications (210 X 297 public)

Claims (1)

經濟部智慧財產局員工消費合作社印製 4 63 19丨 頜 C8 D8 六、申請專利範圍 1. 一種單片式電容器，其係包括： 多個單片陶瓷電容元件，其在兩端具有外部電極； 各單片陶瓷電容元件的外部電極佈置覆蓋整個表面的焊層； 與各單片陶瓷電容元件的外部電極電連接的金屬接線 端；其特徵在於： 各單片陶瓷電容元件互相疊置並通過焊層彼此連接； 所述單片陶瓷電容元件的外部電極通過所述焊層彼此電連 接。 2. 如申請專利範圍第1項所述的單片式電容器，其中， 該各金屬接線端通過所述焊層與至少一個單片陶瓷電容元 件直接連接。 3. 如申請專利範圍第2項所述的單片式電容器，其中， 該各金屬接線端不能與至少一個其他的單片陶瓷電容元件 直接連接。 4. 如申請專利範圍第1項所述的單片式電容器，其中， 該每個金屬接線端包括中間部分，位於所述中間部分的一 個邊緣上的端部，它面向所述中間部分，其間有間隔，以 及位於所述中間部分另一邊緣上的端部，而所述端部被佈 置成給所述金屬接線端以彈性，並通過該焊層其中之一與 所述單片陶瓷電容元件的外部電極相連。 5. 如申請專利範圍第4項所述的單片式電容器，其中， 在所述金屬接線端的內表面上佈置阻礙焊接的膜層。 6. 如申請專利範圍第1項所述的單片式電容器，其中， 金屬接線端上包括至少一個切口，其被佈置成用以調節金 1 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）_ (請先閱讀背面之注意事項再填寫本頁) -------訂------- ·!線 L----------------------- A8 B8 C8 D8 63 1 91 六、申請專利範圍 屬接線端的電抗分量。 7·如申請專利範圍第1項所述的單片式電容器，其中， 所述多個單片陶瓷電容元件中的每一個都包括具有多個介 電層的疊層，以及多個內部電極，其被交替地佈置在所述 多個介電層上。 8. 如申請專利範圍第1項所述的單片式電容器，其中， 至少一個所述外部電極包括Cu層、Ni層和Sn層。 9. 如申請專利範圍第1項所述的單片式電容器，其中， 所述多個單片陶瓷電容元件至少包括三個單片陶瓷電容元 件’而且所述至少三個單片陶瓷電容元件被連接在一起。 10. 如申請專利範圍1所述的單片式電容器，其中，所 述金屬接線端由Fe-Cr合金製成。 U.如申請專利範圍第1項所述的單片式電容器，其中， 所述焊層由含Sn的高溫焊劑制得。 Π_如申請專利範圍第1項所述的單片式電容器，其中， 所述金屬接線端包括端部，其與多個單片陶瓷電容元件之 一的外部電極連接。 13.如申請專利範圍第12項所述的單片式電容器，其 中，所述金屬接線端的端部的縱向長度實質上等於連在一 起的多個單片電容元件的高度。 Μ.如申請專利範圍第13項所述的單片式電容器，其 中，所述連在一起的單片電容元件的數目爲3。 I5.如申請專利範圍第13項所述的單片式電容器，其 中，所述連在一起的單片電容元件的數目爲2。 2 《請先閱讀背面之注意事項再填寫本頁) I ^--- 訂---------線！ 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 16 3 191 六、申請專利範圍 16. 如申請專利範圍第12項所述的單片式電容器’其 中，所述金屬接線端的端部的縱向長度長於多個單片電容 元件連在一起的高度。 17. 如申請專利範圍第1項所述的單片式電容器，其中’ 每個所述金屬接線端上至少形成一個切口。 18. 如申請專利範圍第Π項所述的單片式電容器，其 中，所述至少一個切口位於每個金屬接線端的中間部分的 靠近中心處。 19. 如申請專利範圍第1項所述的單片式電容器，其中， 每個所述金屬接線端上形成多個切口。 20. 如申請專利範圍第19項所述的單片式電容器，其 中，所述多個切口位於所述金屬接線端的中間部分的靠近 中心處。 -------------| -------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 3 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 63 19 丨 Jaw C8 D8 VI. Patent application scope 1. A monolithic capacitor, comprising: a plurality of monolithic ceramic capacitor elements, which have external electrodes at both ends; The external electrode of each monolithic ceramic capacitor element is arranged with a solder layer covering the entire surface; a metal terminal electrically connected to the outer electrode of each monolithic ceramic capacitor element; it is characterized in that: each monolithic ceramic capacitor element is stacked on each other and is welded Layers are connected to each other; external electrodes of the monolithic ceramic capacitor element are electrically connected to each other through the solder layer. 2. The monolithic capacitor according to item 1 of the scope of patent application, wherein each metal terminal is directly connected to at least one monolithic ceramic capacitor element through the solder layer. 3. The monolithic capacitor according to item 2 of the scope of the patent application, wherein the metal terminals cannot be directly connected to at least one other monolithic ceramic capacitor element. 4. The monolithic capacitor according to item 1 of the scope of patent application, wherein each metal terminal includes a middle portion, an end located on one edge of the middle portion, which faces the middle portion, and between There is a gap and an end portion on the other edge of the middle portion, and the end portion is arranged to give elasticity to the metal terminal and pass one of the solder layers to the monolithic ceramic capacitor element The external electrodes are connected. 5. The monolithic capacitor according to item 4 of the scope of patent application, wherein a film layer that prevents soldering is arranged on the inner surface of the metal terminal. 6. The monolithic capacitor according to item 1 of the scope of the patent application, wherein the metal terminal includes at least one cutout, which is arranged to adjust the gold. The paper size is applicable to the Chinese National Standard (CNS) A4 specification ( 210 X 297 mm) _ (Please read the precautions on the back before filling out this page) ------- Order ------- ·! Line L ----------- ------------ A8 B8 C8 D8 63 1 91 6. The scope of patent application is the reactance component of the terminal. 7. The monolithic capacitor according to item 1 of the scope of patent application, wherein each of the plurality of monolithic ceramic capacitor elements includes a stack having a plurality of dielectric layers, and a plurality of internal electrodes, It is alternately arranged on the plurality of dielectric layers. 8. The monolithic capacitor according to item 1 of the scope of patent application, wherein at least one of the external electrodes includes a Cu layer, a Ni layer, and a Sn layer. 9. The monolithic capacitor according to item 1 of the scope of patent application, wherein the plurality of monolithic ceramic capacitor elements includes at least three monolithic ceramic capacitor elements, and the at least three monolithic ceramic capacitor elements are connected together. 10. The monolithic capacitor according to claim 1, wherein the metal terminal is made of Fe-Cr alloy. U. The monolithic capacitor according to item 1 of the scope of the patent application, wherein the solder layer is made of a high-temperature solder containing Sn. Π_ The monolithic capacitor according to item 1 of the scope of patent application, wherein the metal terminal includes an end portion which is connected to an external electrode of one of a plurality of monolithic ceramic capacitor elements. 13. The monolithic capacitor according to item 12 of the scope of patent application, wherein the longitudinal length of the end portion of the metal terminal is substantially equal to the height of a plurality of monolithic capacitor elements connected together. M. The monolithic capacitor according to item 13 of the scope of patent application, wherein the number of the monolithic capacitor elements connected together is three. I5. The monolithic capacitor according to item 13 of the scope of patent application, wherein the number of the monolithic capacitor elements connected together is two. 2 "Please read the notes on the back before filling this page) I ^ --- Order --------- line! The paper size printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 16 3 191 VI. Application for patent scope 16. As stated in item 12 of the scope of patent application The chip capacitor 'wherein a longitudinal length of an end portion of the metal terminal is longer than a height at which a plurality of monolithic capacitor elements are connected together. 17. The monolithic capacitor according to item 1 of the scope of patent application, wherein at least one cutout is formed in each of the metal terminals. 18. The monolithic capacitor according to item Π of the patent application scope, wherein the at least one cutout is located near the center of the middle portion of each metal terminal. 19. The monolithic capacitor according to item 1 of the scope of patent application, wherein a plurality of cutouts are formed in each of the metal terminals. 20. The monolithic capacitor according to item 19 of the scope of patent application, wherein the plurality of cutouts are located near a center of a middle portion of the metal terminal. ------------- | ------- Order --------- line (Please read the notes on the back before filling this page) Intellectual Property Bureau of the Ministry of Economic Affairs Printed by Employee Consumer Cooperatives 3 This paper is sized for China National Standard (CNS) A4 (210 X 297 mm)
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